K4B4G1646D-BYK00 vs H5AN8G4NCJR-XXC Comparison
Detailed side-by-side comparison of K4B4G1646D-BYK00 by Samsung Electronics and H5AN8G4NCJR-xxC by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K4B4G1646D-BYK00 - 4Gb DDR3L SDRAM 256Mx16 96FBGA | Samsung
K4B4G1646D-BYK00 ✓ Active
Specification Comparison
| Parameter | K4B4G1646D-BYK00 | H5AN8G4NCJR-xxC |
|---|---|---|
| Brand | Samsung Electronics | SK hynix |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $7.50 | $8.50 |
| Memory Type | DDR3L SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 8Gb |
| Organization | 256M x 16 | x4 (H5AN8G4NCJR) |
| Data Rate | 1600 Mbps | [DATA_NEEDED: speed grade from xxC suffix] |
| Supply Voltage | 1.35 V (also operates at 1.5 V) | 1.2V |
| Package | 96-ball TFBGA | FBGA |
| Number of Terminals | 96 | — |
| Operating Temperature | 0°C to 85°C | [DATA_NEEDED: operating temperature range] |
| CAS Latency | Programmable | — |
| Additional Features | Auto precharge, asynchronous reset, ZQ calibration, data mask, dynamic on-chip termination | — |
| RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Halogen Free | Yes | Yes |
| Package Shape | RECTANGULAR | — |
| Temperature Grade | OTHER | — |
| Mounting Type | — | Surface Mount |
| Prefetch | — | 8-bit |
| Burst Length | — | 8 (BL8) |
| Refresh | — | Auto-refresh and self-refresh |
| On-Die Termination | — | Yes |