K9PRGY8S7M-CCK0 vs K9ADGD8S0A Comparison
Detailed side-by-side comparison of K9PRGY8S7M-CCK0 by Samsung Electronics and K9ADGD8S0A by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K9PRGY8S7M-CCK0 - Samsung NAND Flash Memory BGA | Samsung
K9PRGY8S7M-CCK0 ✓ ActiveSpecification Comparison
| Parameter | K9PRGY8S7M-CCK0 | K9ADGD8S0A |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | EEPROM | EEPROM |
| Lifecycle Status | Active | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Memory Type | NAND Flash | — |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| Package | BGA (surface mount) | [DATA_NEEDED: package] |
| Mounting Type | Surface Mount | — |
| RoHS Status | Lead free / RoHS compliant | — |
| Density | [DATA_NEEDED: density] | — |
| Memory Bus Width | [DATA_NEEDED: bus width] | — |
| Supply Voltage | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: supply voltage] |
| Interface | [DATA_NEEDED: interface type] | [DATA_NEEDED: interface type] |
| Page Size | [DATA_NEEDED: page size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: block size] | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature] |
| Program/Erase Cycles | [DATA_NEEDED: P/E cycle endurance] | [DATA_NEEDED: endurance] |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Package Ball Count | [DATA_NEEDED: BGA ball count] | — |
| Device Type | — | 3D V-NAND flash memory bare die |
| Process Technology | — | Terabit Cell Array Transistor (TCAT) |
| Architecture | — | 3D vertical NAND (V-NAND) |
| Form Factor | — | Bare die (unpackaged) |
| Found In | — | Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages |
| Known Application | — | Samsung 850 Pro 128 GB SSD |
| Memory Class | — | Non-volatile NAND flash |
| Documented By | — | TechInsights report SAR-1407-802 |
| Capacity | — | [DATA_NEEDED: die capacity] |