K9PRGY8S7M vs K9ADGD8S0A Comparison
Detailed side-by-side comparison of K9PRGY8S7M by Samsung Electronics and K9ADGD8S0A by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Samsung Electronics
K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics
K9PRGY8S7M ✓ ActiveSpecification Comparison
| Parameter | K9PRGY8S7M | K9ADGD8S0A |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Category | Memory ICs | EEPROM |
| Lifecycle Status | Active | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Memory Type | NAND Flash | — |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| Density | [DATA_NEEDED: density] | — |
| Organization | [DATA_NEEDED: organization] | — |
| Interface Type | [DATA_NEEDED: interface type] | — |
| Supply Voltage | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: supply voltage] |
| Page Size | [DATA_NEEDED: page size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: block size] | — |
| Program/Erase Cycles | [DATA_NEEDED: P/E cycles] | [DATA_NEEDED: endurance] |
| Access Time | [DATA_NEEDED: access time] | — |
| Package Type | BGA (surface mount) | — |
| Package Pin/Ball Count | [DATA_NEEDED: ball count] | — |
| Mounting Type | Surface Mount | — |
| Operating Temperature | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature] |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Device Type | — | 3D V-NAND flash memory bare die |
| Process Technology | — | Terabit Cell Array Transistor (TCAT) |
| Architecture | — | 3D vertical NAND (V-NAND) |
| Form Factor | — | Bare die (unpackaged) |
| Found In | — | Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages |
| Known Application | — | Samsung 850 Pro 128 GB SSD |
| Memory Class | — | Non-volatile NAND flash |
| Documented By | — | TechInsights report SAR-1407-802 |
| Capacity | — | [DATA_NEEDED: die capacity] |
| Interface | — | [DATA_NEEDED: interface type] |
| Package | — | [DATA_NEEDED: package] |