K9PRGY8S7M vs K9ADGD8S0A Vergleich
Detaillierter Direktvergleich von K9PRGY8S7M von Samsung Electronics und K9ADGD8S0A von Samsung Electronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Samsung Electronics
K9PRGY8S7M - Samsung NAND Flash Memory IC | Samsung Electronics
K9PRGY8S7M ✓ AktivSpezifikationsvergleich
| Parameter | K9PRGY8S7M | K9ADGD8S0A |
|---|---|---|
| Marke | Samsung Electronics | Samsung Electronics |
| Kategorie | Memory ICs | EEPROM |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Speichertyp | NAND Flash | — |
| Manufacturer | Samsung Electronics | Samsung Electronics |
| Density | [DATA_NEEDED: density] | — |
| Speicherorganisation | [DATA_NEEDED: organization] | — |
| Schnittstellentyp | [DATA_NEEDED: interface type] | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage] | [DATA_NEEDED: supply voltage] |
| Page Size | [DATA_NEEDED: page size] | [DATA_NEEDED: page size] |
| Block Size | [DATA_NEEDED: block size] | — |
| Program/Erase Cycles | [DATA_NEEDED: P/E cycles] | [DATA_NEEDED: endurance] |
| Access Time | [DATA_NEEDED: access time] | — |
| Package Type | BGA (surface mount) | — |
| Package Pin/Ball Count | [DATA_NEEDED: ball count] | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature] | [DATA_NEEDED: operating temperature] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Device Type | — | 3D V-NAND flash memory bare die |
| Process Technology | — | Terabit Cell Array Transistor (TCAT) |
| Architecture | — | 3D vertical NAND (V-NAND) |
| Form Factor | — | Bare die (unpackaged) |
| Found In | — | Samsung K9HQGY8S5M-CCK0 and K9LPGY8S1M-CCK0 packages |
| Known Application | — | Samsung 850 Pro 128 GB SSD |
| Memory Class | — | Non-volatile NAND flash |
| Documented By | — | TechInsights report SAR-1407-802 |
| Capacity | — | [DATA_NEEDED: die capacity] |
| Schnittstelle | — | [DATA_NEEDED: interface type] |
| Gehäuse | — | [DATA_NEEDED: package] |