LCMXO3LF-6900C-5BG256C vs LFE2-6E-5F256C Comparison
Detailed side-by-side comparison of LCMXO3LF-6900C-5BG256C by Lattice Semiconductor and LFE2-6E-5F256C by Lattice Semiconductor. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Lattice Semiconductor
LCMXO3LF-6900C-5BG256C - 6864-LUT MachXO3LF FPGA | Lattice
LCMXO3LF-6900C-5BG256C ✓ ActiveLattice Semiconductor
LFE2-6E-5F256C - 6K Lattice ECP2 FPGA, 190 I/O | Lattice
LFE2-6E-5F256C UnknownSpecification Comparison
| Parameter | LCMXO3LF-6900C-5BG256C | LFE2-6E-5F256C |
|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Unknown |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Device Type | MachXO3LF field-programmable gate array (FPGA) | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Elements | 6,864 LUTs | 6,000 cells |
| Embedded Memory | 240 Kbits | — |
| I/O Count | 206 I/Os | — |
| Supply Voltage | 2.5 V and 3.3 V | 1.14 V to 1.26 V |
| Package | 256-LFBGA | 256-pin FBGA, 17 x 17 mm |
| Package Type | BGA-256 | FBGA |
| Speed Grade | Slow grade | — |
| Temperature Grade | Commercial | — |
| Configuration | Non-volatile, instant-on FPGA | — |
| I/O Signaling | MIPI, LVDS, and sub-LVDS support identified in verified data | — |
| Programmable Logic | FPGA LUT-based programmable logic | — |
| Embedded RAM Type | Embedded block RAM | — |
| Development Support | MachXO3LF Starter Kit supported | — |
| Configuration Memory Support | SPI Flash external boot and dual-boot evaluation support | — |
| Mounting Type | Surface mount | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH status] |
| Logic Array Blocks | — | 750 LABs |
| User I/O | — | 190 pins |
| Total RAM | — | 56,320 bits |
| Nominal Supply Class | — | 1.2 V |
| Operating Junction Temperature | — | 0°C to 85°C |
| Process Technology | — | 90 nm |
| Number of Package Pins | — | 256 pins |
| DSP Capability | — | Advanced DSP blocks |
| SERDES Capability | — | [DATA_NEEDED: LFE2-6E-5F256C-specific SERDES capability] |
| Programming Configuration | — | [DATA_NEEDED: configuration memory and programming interface] |