LSM6DSO32XTR vs LSM6DSRTR Comparison

Detailed side-by-side comparison of LSM6DSO32XTR by STMicroelectronics and LSM6DSRTR by STMicroelectronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

STMicroelectronics
LSM6DSO32XTR LSM6DSO32XTR - 32g 6-Axis IMU with ML Core | ST

LSM6DSO32XTR - 32g 6-Axis IMU with ML Core | ST

LSM6DSO32XTR ✓ Active
STMicroelectronics
LSM6DSRTR LSM6DSRTR - 6-Axis IMU w/ 4000dps Gyro | STMicroelectronics

LSM6DSRTR - 6-Axis IMU w/ 4000dps Gyro | STMicroelectronics

LSM6DSRTR ✓ Active

Specification Comparison

Parameter LSM6DSO32XTR LSM6DSRTR
Brand STMicroelectronics STMicroelectronics
Category Motion Sensors Motion Sensors
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $3.20 $4.10
Sensor Type 6-axis IMU (3-axis accelerometer + 3-axis gyroscope) Accelerometer, Gyroscope, Temperature (6-axis IMU)
Accelerometer Full Scale +/-2 g to +/-32 g (user selectable) —
Gyroscope Full Scale +/-125 dps to +/-4000 dps —
Output Data Rate Up to 6.66 kHz (accelerometer and gyroscope) —
High-Performance Mode Current 0.55 mA (typical) —
Supply Voltage 1.71 V to 3.6 V 1.71 V to 3.6 V
Interface I2C / SPI (3-wire and 4-wire) —
Embedded Features Finite State Machine (FSM), Machine Learning Core (MLC), Sensor Fusion Low Power (SFLP) —
Temperature Sensor Yes, on-chip —
FIFO Yes, smart FIFO with configurable watermark Up to 4 kB (configurable)
Interrupts 2 programmable hardware interrupt pins (INT1, INT2) —
Package LGA-14, 2.5 x 3.0 x 0.83 mm LGA-14 (2.5 x 3.0 mm)
Operating Temperature -40 C to +85 C -40 C to +85 C
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant Compliant
Output Interface — I2C, SPI, I3C
Accelerometer Full-Scale Range — ±2/±4/±8/±16 g
Gyroscope Full-Scale Range — ±125/±250/±500/±1000/±2000/±4000 dps
Accelerometer Noise Density — [DATA_NEEDED: accel noise density]
Gyroscope Noise Density — [DATA_NEEDED: gyro noise density]
MSL Level — [DATA_NEEDED: MSL level]
On-chip Processing — MLC (Machine Learning Core), FSM, sensor hub
Shipping Packaging — Tape & Reel (TR suffix)

Datasheets & Resources

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