LSM6DSO32XTR vs LSM6DSRTR Comparaison
Comparaison détaillée côte à côte de LSM6DSO32XTR par STMicroelectronics et LSM6DSRTR par STMicroelectronics. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | LSM6DSO32XTR | LSM6DSRTR |
|---|---|---|
| Marque | STMicroelectronics | STMicroelectronics |
| Catégorie | Motion Sensors | Motion Sensors |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,20 | $4,10 |
| Type de capteur | 6-axis IMU (3-axis accelerometer + 3-axis gyroscope) | Accelerometer, Gyroscope, Temperature (6-axis IMU) |
| Accelerometer Full Scale | +/-2 g to +/-32 g (user selectable) | — |
| Gyroscope Full Scale | +/-125 dps to +/-4000 dps | — |
| Output Data Rate | Up to 6.66 kHz (accelerometer and gyroscope) | — |
| High-Performance Mode Current | 0.55 mA (typical) | — |
| Tension d'alimentation | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Interface | I2C / SPI (3-wire and 4-wire) | — |
| Embedded Features | Finite State Machine (FSM), Machine Learning Core (MLC), Sensor Fusion Low Power (SFLP) | — |
| Temperature Sensor | Yes, on-chip | — |
| FIFO | Yes, smart FIFO with configurable watermark | Up to 4 kB (configurable) |
| Interrupts | 2 programmable hardware interrupt pins (INT1, INT2) | — |
| Boîtier | LGA-14, 2.5 x 3.0 x 0.83 mm | LGA-14 (2.5 x 3.0 mm) |
| Température de fonctionnement | -40 C to +85 C | -40 C to +85 C |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant | Compliant |
| Output Interface | — | I2C, SPI, I3C |
| Accelerometer Full-Scale Range | — | ±2/±4/±8/±16 g |
| Gyroscope Full-Scale Range | — | ±125/±250/±500/±1000/±2000/±4000 dps |
| Accelerometer Noise Density | — | [DATA_NEEDED: accel noise density] |
| Gyroscope Noise Density | — | [DATA_NEEDED: gyro noise density] |
| Niveau MSL | — | [DATA_NEEDED: MSL level] |
| On-chip Processing | — | MLC (Machine Learning Core), FSM, sensor hub |
| Shipping Packaging | — | Tape & Reel (TR suffix) |