LSM6DSO32XTR vs LSM6DSRTR Vergleich

Detaillierter Direktvergleich von LSM6DSO32XTR von STMicroelectronics und LSM6DSRTR von STMicroelectronics. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

STMicroelectronics
LSM6DSO32XTR LSM6DSO32XTR - 32g 6-Axis IMU with ML Core | ST

LSM6DSO32XTR - 32g 6-Axis IMU with ML Core | ST

LSM6DSO32XTR ✓ Aktiv
STMicroelectronics
LSM6DSRTR LSM6DSRTR - 6-Axis IMU w/ 4000dps Gyro | STMicroelectronics

LSM6DSRTR - 6-Axis IMU w/ 4000dps Gyro | STMicroelectronics

LSM6DSRTR ✓ Aktiv

Spezifikationsvergleich

Parameter LSM6DSO32XTR LSM6DSRTR
Marke STMicroelectronics STMicroelectronics
Kategorie Motion Sensors Motion Sensors
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $3,20 $4,10
Sensortyp 6-axis IMU (3-axis accelerometer + 3-axis gyroscope) Accelerometer, Gyroscope, Temperature (6-axis IMU)
Accelerometer Full Scale +/-2 g to +/-32 g (user selectable) —
Gyroscope Full Scale +/-125 dps to +/-4000 dps —
Output Data Rate Up to 6.66 kHz (accelerometer and gyroscope) —
High-Performance Mode Current 0.55 mA (typical) —
Versorgungsspannung 1.71 V to 3.6 V 1.71 V to 3.6 V
Schnittstelle I2C / SPI (3-wire and 4-wire) —
Embedded Features Finite State Machine (FSM), Machine Learning Core (MLC), Sensor Fusion Low Power (SFLP) —
Temperature Sensor Yes, on-chip —
FIFO Yes, smart FIFO with configurable watermark Up to 4 kB (configurable)
Interrupts 2 programmable hardware interrupt pins (INT1, INT2) —
Gehäuse LGA-14, 2.5 x 3.0 x 0.83 mm LGA-14 (2.5 x 3.0 mm)
Betriebstemperatur -40 C to +85 C -40 C to +85 C
Montageart Surface Mount Surface Mount
RoHS-Status Compliant Compliant
Output Interface — I2C, SPI, I3C
Accelerometer Full-Scale Range — ±2/±4/±8/±16 g
Gyroscope Full-Scale Range — ±125/±250/±500/±1000/±2000/±4000 dps
Accelerometer Noise Density — [DATA_NEEDED: accel noise density]
Gyroscope Noise Density — [DATA_NEEDED: gyro noise density]
MSL-Level — [DATA_NEEDED: MSL level]
On-chip Processing — MLC (Machine Learning Core), FSM, sensor hub
Shipping Packaging — Tape & Reel (TR suffix)

Datenblätter & Ressourcen

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