LSM6DSO32XTR vs LSM6DSRTR Comparação
Comparação detalhada lado a lado de LSM6DSO32XTR por STMicroelectronics e LSM6DSRTR por STMicroelectronics. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | LSM6DSO32XTR | LSM6DSRTR |
|---|---|---|
| Marca | STMicroelectronics | STMicroelectronics |
| Categoria | Motion Sensors | Motion Sensors |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3,20 | $4,10 |
| Tipo de sensor | 6-axis IMU (3-axis accelerometer + 3-axis gyroscope) | Accelerometer, Gyroscope, Temperature (6-axis IMU) |
| Accelerometer Full Scale | +/-2 g to +/-32 g (user selectable) | — |
| Gyroscope Full Scale | +/-125 dps to +/-4000 dps | — |
| Output Data Rate | Up to 6.66 kHz (accelerometer and gyroscope) | — |
| High-Performance Mode Current | 0.55 mA (typical) | — |
| Tensão de alimentação | 1.71 V to 3.6 V | 1.71 V to 3.6 V |
| Interface | I2C / SPI (3-wire and 4-wire) | — |
| Embedded Features | Finite State Machine (FSM), Machine Learning Core (MLC), Sensor Fusion Low Power (SFLP) | — |
| Temperature Sensor | Yes, on-chip | — |
| FIFO | Yes, smart FIFO with configurable watermark | Up to 4 kB (configurable) |
| Interrupts | 2 programmable hardware interrupt pins (INT1, INT2) | — |
| Encapsulamento | LGA-14, 2.5 x 3.0 x 0.83 mm | LGA-14 (2.5 x 3.0 mm) |
| Temperatura de operação | -40 C to +85 C | -40 C to +85 C |
| Tipo de montagem | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Output Interface | — | I2C, SPI, I3C |
| Accelerometer Full-Scale Range | — | ±2/±4/±8/±16 g |
| Gyroscope Full-Scale Range | — | ±125/±250/±500/±1000/±2000/±4000 dps |
| Accelerometer Noise Density | — | [DATA_NEEDED: accel noise density] |
| Gyroscope Noise Density | — | [DATA_NEEDED: gyro noise density] |
| Nível MSL | — | [DATA_NEEDED: MSL level] |
| On-chip Processing | — | MLC (Machine Learning Core), FSM, sensor hub |
| Shipping Packaging | — | Tape & Reel (TR suffix) |