M1AFS1500-1FGG256 vs M1AFS1500-1FGG256I Comparison
Detailed side-by-side comparison of M1AFS1500-1FGG256 by Microchip Technology and M1AFS1500-1FGG256I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActiveMicrochip Technology
M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256I ✓ ActiveSpecification Comparison
| Parameter | M1AFS1500-1FGG256 | M1AFS1500-1FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $172.23 | $136.90 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | 1.5 million |
| Logic Cells | 38,400 | 38400 |
| Embedded Processor | ARM Cortex-M1 | — |
| Maximum Clock Frequency | 350 MHz | — |
| Number of I/Os | 119 | — |
| Supply Voltage | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | — |
| Package / Case | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Mounting Style | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Speed Grade | -1 | -1 (standard) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | Integrated CCC (clock conditioning circuits) |
| Family | — | Fusion (M1 series, mixed-signal FPGA) |
| Processor Core | — | ARM Cortex-M1 (soft core in fabric) |
| User I/O | — | 119 |
| Flash Configuration Memory | — | 276480 bits |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash-based |
| Package | — | 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch |
| Operating Temperature | — | -40C to +85C (industrial, I suffix) |
| Configuration Type | — | Flash-based, instant-on, single chip |
| Security | — | 128-bit flash lock, AES decryption |
| Analog Features | — | Configurable analog blocks (mixed-signal) |
| Mounting Type | — | Surface Mount |