M1AFS1500-1FGG256 vs M1AFS1500-1FGG256I Comparaison
Comparaison détaillée côte à côte de M1AFS1500-1FGG256 par Microchip Technology et M1AFS1500-1FGG256I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActifMicrochip Technology
M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
M1AFS1500-1FGG256I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-1FGG256 | M1AFS1500-1FGG256I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $172,23 | $136,90 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | 1.5 million |
| Logic Cells | 38,400 | 38400 |
| Embedded Processor | ARM Cortex-M1 | — |
| Fréquence d'horloge maximale | 350 MHz | — |
| Number of I/Os | 119 | — |
| Tension d'alimentation | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | — |
| Boîtier / Format | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Style de montage | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | — |
| Speed Grade | -1 | -1 (standard) |
| Statut RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | Integrated CCC (clock conditioning circuits) |
| Family | — | Fusion (M1 series, mixed-signal FPGA) |
| Processor Core | — | ARM Cortex-M1 (soft core in fabric) |
| User I/O | — | 119 |
| Flash Configuration Memory | — | 276480 bits |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm flash-based |
| Boîtier | — | 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch |
| Température de fonctionnement | — | -40C to +85C (industrial, I suffix) |
| Configuration Type | — | Flash-based, instant-on, single chip |
| Security | — | 128-bit flash lock, AES decryption |
| Analog Features | — | Configurable analog blocks (mixed-signal) |
| Type de montage | — | Surface Mount |