M1AFS1500-1FGG256I vs M1AFS1500-FG256K Comparison

Detailed side-by-side comparison of M1AFS1500-1FGG256I by Microchip Technology and M1AFS1500-FG256K by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M1AFS1500-1FGG256I M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256I ✓ Active
Microchip Technology
M1AFS1500-FG256K M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS1500-FG256K ✓ Active

Specification Comparison

Parameter M1AFS1500-1FGG256I M1AFS1500-FG256K
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $136.90 $341.46
Family Fusion (M1 series, mixed-signal FPGA) Fusion (M1 - ARM Cortex-M1 enabled)
System Gates 1.5 million 1500000
Processor Core ARM Cortex-M1 (soft core in fabric) —
User I/O 119 119
Flash Configuration Memory 276480 bits —
Logic Cells 38400 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm flash-based —
Package 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch 256-LBGA (FBGA/FG256)
Operating Temperature -40C to +85C (industrial, I suffix) [DATA_NEEDED: operating temperature range for FG256K suffix]
Speed Grade -1 (standard) Standard (no dash letter suffix)
Configuration Type Flash-based, instant-on, single chip —
Security 128-bit flash lock, AES decryption —
Analog Features Configurable analog blocks (mixed-signal) —
Clock Management Integrated CCC (clock conditioning circuits) Integrated clock generation and management circuitry
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Flash Memory Cells — 276480
Embedded Processor — ARM Cortex-M1
Supply Voltage — 1.425 V to 1.575 V
Core Process Technology — 130 nm flash
Packaging — Tray
Configuration Memory — On-chip flash (live at power-up)
Analog Peripherals — Integrated configurable analog blocks

Datasheets & Resources

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