M1AFS1500-1FGG256I vs M1AFS1500-FG256K Vergleich

Detaillierter Direktvergleich von M1AFS1500-1FGG256I von Microchip Technology und M1AFS1500-FG256K von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
M1AFS1500-1FGG256I M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256I - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip

M1AFS1500-1FGG256I ✓ Aktiv
Microchip Technology
M1AFS1500-FG256K M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS1500-FG256K - 1.5M-Gate Fusion Mixed-Signal FPGA | Microchip

M1AFS1500-FG256K ✓ Aktiv

Spezifikationsvergleich

Parameter M1AFS1500-1FGG256I M1AFS1500-FG256K
Marke Microchip Technology Microchip Technology
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $136,90 $341,46
Family Fusion (M1 series, mixed-signal FPGA) Fusion (M1 - ARM Cortex-M1 enabled)
System Gates 1.5 million 1500000
Processor Core ARM Cortex-M1 (soft core in fabric) —
User I/O 119 119
Flash Configuration Memory 276480 bits —
Logic Cells 38400 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm flash-based —
Gehäuse 256-LBGA (FBGA), 17x17 mm, 1.0 mm ball pitch 256-LBGA (FBGA/FG256)
Betriebstemperatur -40C to +85C (industrial, I suffix) [DATA_NEEDED: operating temperature range for FG256K suffix]
Speed Grade -1 (standard) Standard (no dash letter suffix)
Configuration Type Flash-based, instant-on, single chip —
Security 128-bit flash lock, AES decryption —
Analog Features Configurable analog blocks (mixed-signal) —
Clock Management Integrated CCC (clock conditioning circuits) Integrated clock generation and management circuitry
Montageart Surface Mount Surface Mount
RoHS-Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Flash Memory Cells — 276480
Embedded Processor — ARM Cortex-M1
Versorgungsspannung — 1.425 V to 1.575 V
Core Process Technology — 130 nm flash
Packaging — Tray
Configuration Memory — On-chip flash (live at power-up)
Analog Peripherals — Integrated configurable analog blocks

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