M1AFS1500-FG256I vs M1AFS1500-1FGG256 Comparison
Detailed side-by-side comparison of M1AFS1500-FG256I by Microchip Technology and M1AFS1500-1FGG256 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip
M1AFS1500-FG256I ✓ ActiveMicrochip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActiveSpecification Comparison
| Parameter | M1AFS1500-FG256I | M1AFS1500-1FGG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $341.46 | $172.23 |
| Family | Fusion Mixed-Signal FPGA (M1 series) | — |
| System Gates | 1500000 gates | 1,500,000 |
| User I/O | 119 | — |
| Flash Memory | 276480 bits | — |
| Logic Technology | 130 nm flash-based CMOS, 7-layer metal | — |
| System Performance | 350 MHz | — |
| Core Supply Voltage | 1.5 V | — |
| Package | 256-LBGA (FG256) | — |
| Mounting Type | Surface Mount | — |
| Processor Support | ARM Cortex-M1 soft core | — |
| Security | 128-bit flash lock with AES decryption | — |
| Configuration | Nonvolatile flash, Live at Power-Up (LAPU) | — |
| Temperature Grade | I (Industrial), -40C to +85C | — |
| Analog Features | Configurable analog blocks (mixed-signal) | — |
| Clock Management | On-chip clock generation and management circuitry | Integrated clock generation and management circuitry |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Series | — | Fusion (M1AFS1500) |
| Logic Cells | — | 38,400 |
| Embedded Processor | — | ARM Cortex-M1 |
| Maximum Clock Frequency | — | 350 MHz |
| Number of I/Os | — | 119 |
| Supply Voltage | — | 1.5 V |
| Technology | — | CMOS, 130 nm |
| Configuration Memory | — | Flash-based (non-volatile) |
| Package / Case | — | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | — | 1.00 mm |
| Mounting Style | — | SMD/SMT |
| Minimum Operating Temperature | — | 0 C |
| Maximum Operating Temperature | — | +70 C |
| Packaging | — | Tray |
| Speed Grade | — | -1 |
| Integrated Analog Blocks | — | Yes (configurable analog conditioning and conversion) |
| Integrated Flash Memory Blocks | — | Yes |