M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip
MPN: M1AFS1500-FG256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $426.82 | $426.82 |
| 10 | $405.48 | $4,054.80 |
| 100 | $384.14 | $38,414.00 |
| 500 | $362.8 | $181,400.00 |
| 1,000 | $341.46 | $341,460.00 |
M1AFS1500-FG256I Overview
A mixed-signal FPGA is a field-programmable gate array that combines digital programmable fabric with analog peripherals such as ADCs, comparators, and voltage monitors on a single chip. Within the power-management hierarchy, such devices replace a discrete FPGA plus external analog-monitoring ICs, MCU, and configuration flash, reducing BOM count and board area while enabling true single-chip system solutions.
Key features include nonvolatile flash programming that retains configuration when power is removed, Live at Power-Up (LAPU) operation so the device is functional within microseconds of power application, 350 MHz system performance, and 128-bit flash-based security locking with industry-standard AES decryption for protecting IP and configuration data. The flash fabric also eliminates the external configuration PROM required by SRAM FPGAs.
The Fusion architecture embeds large flash memory blocks alongside VersNet analog routing and configurable analog modules, allowing power-supply supervision, fan monitoring, and temperature sensing to be implemented in the same die as the digital control logic. Fabric operates from a 1.5V core supply typical of 130nm flash-based FPGA technology.
Typical applications include system power sequencing and supervision, board-level health monitoring, industrial automation control, and embedded processing nodes using the ARM Cortex-M1 soft core. The single-chip integration of analog monitoring plus digital control makes it a strong fit for intelligent power management in servers and telecom shelves.
When designing with this device, remember that flash FPGAs are inherently secure and instant-on, but analog block ranges and I/O banking rules in the Fusion datasheet must be validated against your system voltages before layout lock.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design guidance not found in the manufacturer datasheet.
Drop-in alternatives for M1AFS1500-FG256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with M1AFS1500-FG256I (same form factor and footprint) — differing in System Gates, Package, Family, Process Technology, Configuration Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-FG256K
✅ Drop-In✓ In Stock
$341.46 / Unit
View Datasheet →M1AFS1500-1FGG256
✅ Drop-In✓ In Stock
$172.23 / Unit
View Datasheet →M1AFS1500-2FGG256
✅ Drop-In✓ In Stock
$124.5 / Unit
View Datasheet →M1AFS600-2FG256
✅ Drop-In✓ In Stock
$46.75 / Unit
View Datasheet →M1AFS250-2FG256I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →M7AFS600-FGG256
✅ Drop-In✓ In Stock
$232.4 / Unit
View Datasheet →M1AFS1500-FG256I Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA (M1 series) |
| System Gates | 1500000 gates |
| User I/O | 119 |
| Flash Memory | 276480 bits |
| Logic Technology | 130 nm flash-based CMOS, 7-layer metal |
| System Performance | 350 MHz |
| Core Supply Voltage | 1.5 V |
| Package | 256-LBGA (FG256) |
| Mounting Type | Surface Mount |
| Processor Support | ARM Cortex-M1 soft core |
| Security | 128-bit flash lock with AES decryption |
| Configuration | Nonvolatile flash, Live at Power-Up (LAPU) |
| Temperature Grade | I (Industrial), -40C to +85C |
| Analog Features | Configurable analog blocks (mixed-signal) |
| Clock Management | On-chip clock generation and management circuitry |
M1AFS1500-FG256I 256-lbga (fg256) Pin Configuration Guide
Pin configuration for M1AFS1500-FG256I (256-lbga (fg256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-FG256I.
Refer to the datasheet for full pin configuration.
Typical Applications
M1AFS1500-FG256I is suitable for 6 applications: Intelligent Power Management and Supervision, Industrial Automation and Control, Server and Telecom Shelf Management, Secure Embedded Processing Nodes, Aerospace and Defense-Adjacent Sensing Systems, Test and Measurement Instrumentation.
Intelligent Power Management and Supervision
The M1AFS1500-FG256I is purpose-built for intelligent power management: its Fusion architecture integrates configurable analog blocks that monitor multiple power-supply rails, temperatures, and fan speeds on a single die, replacing a discrete FPGA, a monitoring MCU, and external ADCs. The Live at Power-Up (LAPU) flash fabric begins supervising rails within microseconds of power application, closing the boot gap that disqualifies SRAM FPGAs from sequencing duty. With 1.5M gates and 276480 bits of flash, it can host full sequencing state machines plus an ARM Cortex-M1 for system management. The trade-off is a 1.5V core supply and FG256 ball pitch that requires careful fanout on 8-10 layer PCBs.
Recommended
Industrial Automation and Control
In industrial automation nodes, the M1AFS1500-FG256I combines deterministic flash-based logic with on-die analog sensing of motor currents, supply rails, and enclosure temperature in the industrial -40C to +85C range. The 350 MHz system performance supports high-speed I/O processing, while the ARM Cortex-M1 soft core runs protocol stacks such as fieldbus interfaces. Nonvolatile configuration means the controller is functional the instant 24V cabinet power is applied, and the 128-bit AES flash lock protects proprietary control IP on field-deployed units. The FG256 industrial-grade package withstands thermal cycling, and no external configuration device is needed, improving vibration reliability in factory equipment.
Recommended
Server and Telecom Shelf Management
Telecom and server shelves require a shelf-management controller that continuously polls voltages, temperatures, and fan states; the M1AFS1500-FG256I does this in a single 256-ball device, using its configurable analog blocks and VersNet analog routing while the 1.5M-gate fabric implements I2C/PMBus masters and hot-swap control logic. Live at Power-Up operation ensures monitoring begins before host CPUs boot, a critical requirement for pre-boot fault logging. The 276480-bit flash stores event logs and firmware, and AES-encrypted configuration prevents tampering in shared infrastructure. Typical designs pair it with the M1AFS600 on smaller blades where monitoring alone is needed.
Recommended
Secure Embedded Processing Nodes
For embedded systems where IP protection is mandatory, the M1AFS1500-FG256I offers a combination unique among FPGAs: nonvolatile on-chip configuration (no external bitstream to intercept), a 128-bit flash-based lock, and AES decryption of programmed data, per the Microsemi Fusion datasheet. The ARM Cortex-M1 soft core executes application firmware from embedded flash, and 1.5M gates leave ample room for crypto accelerators and custom peripherals. Because the design data resides entirely inside the die with readback disabled by the flash lock, reverse-engineering risk is substantially lower than with SRAM FPGAs that load bitstreams from external flash at every power-up.
Recommended
Aerospace and Defense-Adjacent Sensing Systems
While the FG256I is the industrial grade, the same Fusion die is available in K temperature screening (M1AFS1500-FG256K), and the flash-based fabric inherently resists configuration upset from radiation-induced reconfiguration because no external configuration memory can be corrupted - a property valued in high-reliability sensing payloads. The on-die analog blocks digitize sensor channels (temperature, pressure bridge via external conditioning, voltage) while the fabric performs filtering and thresholding at up to 350 MHz system performance. Single-chip integration reduces component count and failure points on size- and weight-constrained platforms; verify screening level and flow against program requirements before selection.
Recommended
Test and Measurement Instrumentation
Bench and rack instruments benefit from the M1AFS1500-FG256I's ability to merge housekeeping (rail and temperature monitoring via on-die analog blocks) with real-time digital acquisition logic in one chip. The 119 user I/O interface to front-end ADCs, relays, and display logic, while the ARM Cortex-M1 handles command parsing over USB or UART implemented in fabric. Instant-on LAPU behavior means the instrument's safety interlocks and self-test are active before the host controller boots, and AES-locked firmware protects calibration algorithms stored in the 276480-bit flash. For lower-channel-count instruments, the same-footprint M1AFS600 reduces cost without layout change.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-FG256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-FG256K | M1AFS1500-1FGG256 | M1AFS600-2FG256 | M1AFS250-2FG256I |
|---|---|---|---|---|---|
| Package | 256-LBGA (FG256) | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same | 256-LBGA (FG256) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5M | 1.5M | 1.5M | 600K | 250K |
| User I/O | 119 | 119 | 119 | 119 | 119 |
| Speed Grade | Standard | Standard | -1 | -2 | -2 |
| Configuration | Nonvolatile flash, LAPU, AES-128 lock | Nonvolatile flash, LAPU, AES-128 lock | Nonvolatile flash, LAPU, AES-128 lock | Nonvolatile flash, LAPU, AES-128 lock | Nonvolatile flash, LAPU, AES-128 lock |
Key Differentiators
- Integrated mixed-signal analog blocks (vs A3P600-1FG256I)
- Full 1.5M-gate capacity in the compact FG256 footprint (vs M1AFS600-2FG256)
- Extended-temperature option without layout change (vs M1AFS1500-FG256K)
Design Notes
The Fusion M1AFS1500 uses a 1.5V core supply typical of 130nm flash CMOS, with separate analog and I/O supply domains per the Fusion family datasheet. Estimated: budget core current based on your implemented gate utilization and toggle rates using Microchip's Libero power analyzer - flash fabric draws essentially zero standby configuration power, unlike SRAM FPGAs. Sequence the analog supply before or with the core to ensure the on-die monitoring blocks power up in a defined state, and validate rail ramp rates against datasheet limits.
The 256-ball LBGA (FG256) requires a fine-pitch BGA land pattern with via-in-pad or dogbone fanout; plan for at least an 8-layer stackup to escape all 119 user I/O plus power balls. Because this is a mixed-signal device, partition the board so analog sense routing to the configurable analog block inputs stays away from switching-regulator nodes, and use a solid ground plane under the die. Follow the Microchip/Microsemi Fusion PCB layout guidelines in the family datasheet for ball-map breakout.
Do not treat this as a digital-only FPGA: the configurable analog blocks have specific input ranges and reference requirements detailed in the Fusion datasheet - exceeding them corrupts monitoring readings or damages the die. Also note the suffix system: only 'I' (industrial) and 'K' (extended) grades are interchangeable footprints with different qualification, and speed grades (-1/-2) change timing closure results in Libero; re-run static timing after any speed-grade substitution.
Compliance Information
Compliance status not stated in the provided web data; verify on the Microchip product page or certificate of conformance. Note that GG-suffix parts in this family denote Pb-free ball options per Microsemi ordering conventions.