M1AFS1500-FG256I vs M1AFS1500-1FGG256 Comparação

Comparação detalhada lado a lado de M1AFS1500-FG256I por Microchip Technology e M1AFS1500-1FGG256 por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS1500-FG256I M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip

M1AFS1500-FG256I - Fusion Mixed-Signal FPGA, 1.5M Gates | Microchip

M1AFS1500-FG256I ✓ Ativo
Microchip Technology
M1AFS1500-1FGG256 M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip

M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip

M1AFS1500-1FGG256 ✓ Ativo

Comparação de especificações

Parâmetro M1AFS1500-FG256I M1AFS1500-1FGG256
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $341,46 $172,23
Family Fusion Mixed-Signal FPGA (M1 series) —
System Gates 1500000 gates 1,500,000
User I/O 119 —
Flash Memory 276480 bits —
Logic Technology 130 nm flash-based CMOS, 7-layer metal —
System Performance 350 MHz —
Core Supply Voltage 1.5 V —
Encapsulamento 256-LBGA (FG256) —
Tipo de montagem Surface Mount —
Processor Support ARM Cortex-M1 soft core —
Security 128-bit flash lock with AES decryption —
Configuration Nonvolatile flash, Live at Power-Up (LAPU) —
Temperature Grade I (Industrial), -40C to +85C —
Analog Features Configurable analog blocks (mixed-signal) —
Clock Management On-chip clock generation and management circuitry Integrated clock generation and management circuitry
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Moisture Sensitivity Level [DATA_NEEDED: MSL level] —
Series — Fusion (M1AFS1500)
Logic Cells — 38,400
Embedded Processor — ARM Cortex-M1
Frequência máxima de clock — 350 MHz
Number of I/Os — 119
Tensão de alimentação — 1.5 V
Technology — CMOS, 130 nm
Configuration Memory — Flash-based (non-volatile)
Encapsulamento / Caixa — 256-LBGA (FBGA, S-PBGA-B256)
Ball Pitch — 1.00 mm
Estilo de montagem — SMD/SMT
Minimum Operating Temperature — 0 C
Maximum Operating Temperature — +70 C
Packaging — Tray
Speed Grade — -1
Integrated Analog Blocks — Yes (configurable analog conditioning and conversion)
Integrated Flash Memory Blocks — Yes

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