M29F800FB55N3F2 vs M29F800FT55N3F2 Comparison
Detailed side-by-side comparison of M29F800FB55N3F2 by Micron Technology and M29F800FT55N3F2 by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Micron Technology
M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron
M29F800FB55N3F2 ✓ ActiveSpecification Comparison
| Parameter | M29F800FB55N3F2 | M29F800FT55N3F2 |
|---|---|---|
| Brand | Micron Technology | Micron Technology |
| Category | Memory ICs | Memory ICs |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.47 | $0.78 |
| Memory Density | 8389 kbits (8 Mbit) | — |
| Organization | 1M x 8 / 512K x 16 | 1M x 8 bit / 512K x 16 bit |
| Supply Voltage | 5 V | 5 V (single supply) |
| Access Time | 55 ns | 55 ns |
| Interface Type | Parallel NOR | — |
| Boot Block Architecture | Bottom Boot Block | Top boot block (T) |
| Program/Erase Controller | Embedded byte/word program algorithms | — |
| Operating Temperature | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Temperature Grade | Automotive (AEC-Q100) | — |
| Package Type | 48-pin TSOP1 | — |
| Package Shape | Rectangular (JESD designation TSOP1) | — |
| Terminal Count | 48 | — |
| JESD-609 Termination Code | e3 (lead-free) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tape & Reel (T/R) | Tape & Reel (T/R) |
| RoHS Status | Compliant (lead-free terminations) | [DATA_NEEDED: RoHS status] |
| Memory Type | — | NOR Flash, Parallel |
| Memory Size | — | 8 Mbit |
| Interface | — | Parallel |
| Programming Voltage | — | 5.0 V VCC (no 12 V VPP required) |
| Package | — | 48-pin TSOP |
| Erase Block Size | — | [DATA_NEEDED: block size] |
| Data Retention | — | [DATA_NEEDED: data retention] |
| Program/Erase Cycles | — | [DATA_NEEDED: endurance cycles] |
| Active Read Current | — | [DATA_NEEDED: ICC read] |