M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron
MPN: M29F800FB55N3F2 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.1 | $3.10 |
| 10 | $2.9 | $29.00 |
| 100 | $2.65 | $265.00 |
| 500 | $2.55 | $1,275.00 |
| 1,000 | $2.47 | $2,470.00 |
Drop-in alternatives for M29F800FB55N3F2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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M29F800FB55M3F2
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View Datasheet →M29F800FB55N3F2 Maximum Ratings & Electrical Characteristics
| Memory Density | 8389 kbits (8 Mbit) |
| Organization | 1M x 8 / 512K x 16 |
| Supply Voltage | 5 V |
| Access Time | 55 ns |
| Interface Type | Parallel NOR |
| Boot Block Architecture | Bottom Boot Block |
| Program/Erase Controller | Embedded byte/word program algorithms |
| Operating Temperature | -40C to +125C |
| Temperature Grade | Automotive (AEC-Q100) |
| Package Type | 48-pin TSOP1 |
| Package Shape | Rectangular (JESD designation TSOP1) |
| Terminal Count | 48 |
| JESD-609 Termination Code | e3 (lead-free) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T/R) |
| RoHS Status | Compliant (lead-free terminations) |
M29F800FB55N3F2 rectangular (jesd designation tsop1) Pin Configuration Guide
Complete pinout information for M29F800FB55N3F2 (rectangular (jesd designation tsop1) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M29F800FB55N3F2.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M29F800FB55N3F2 is suitable for 6 applications: Automotive ECU Boot Code Storage, Industrial PLC Firmware Memory, Telecom and Networking Line Cards, Test and Measurement Instrument Firmware, Motor Drive and Power Converter Control Boards, Legacy System Repair and EOL Replacement.
Automotive ECU Boot Code Storage
The M29F800FB55N3F2 fits automotive ECU boot storage because it combines AEC-Q100 qualification, a -40C to +125C operating range, and a 5V parallel bus that matches classic 16-bit automotive microcontroller external memory interfaces. Its 55 ns access time allows zero or minimal wait-state code execution (XIP) from reset, while the bottom boot block architecture places reset vectors and calibration parameters in small, frequently reprogrammed blocks at the low address range. Used as direct firmware memory on the ECU's address/data bus with the embedded program/erase controller handling block updates during reflashing sessions per UDS-style workflows, it eliminates external sequencer logic. The trade-off is 5V rail dependence - level shifting is required in mixed 3.3V systems.
Recommended
Industrial PLC Firmware Memory
Industrial programmable logic controllers frequently retain 5V logic families for noise immunity, and the M29F800FB55N3F2's native 5V supply removes level-translation circuitry between the Flash and a 5V processor bus. The 8Mbit density holds PLC ladder-logic interpreters plus application firmware with headroom, and the 55 ns access time supports fast fieldbus stack execution. Its -40C to +125C rating covers unconditioned cabinets and motor-control enclosures, matching industrial temperature requirements without derating analysis. Program/erase via the embedded controller lets service firmware update parameter blocks in the bottom boot region during commissioning. Designers should note the write endurance budget: log data in rotating blocks rather than wearing the boot region, and buffer writes against brownouts because 5V systems tolerate power glitches during erase cycles.
Recommended
Telecom and Networking Line Cards
Legacy telecom line cards and network processors built around 5V buses use the M29F800FB55N3F2 to store boot ROM images, MAC-address blocks, and configuration tables. The parallel 16-bit interface provides the random-access read bandwidth these systems need at power-on, and 55 ns timing meets typical bus-cycle budgets of CISC-era network CPUs. The bottom boot map keeps a small configuration block at address zero for revision identifiers, which field technicians update without erasing the main image. In redundant-card designs, two devices can share a bus with individual enable control, letting standby firmware be updated while the active card serves traffic. Since many line-card platforms are long-lived, second-source planning within the M29F800 family is advisable given parallel NOR lifecycle consolidation.
Recommended
Test and Measurement Instrument Firmware
Bench instruments and handheld 5V test equipment benefit from the M29F800FB55N3F2's 5V operation and -40C to +125C range, which tolerates both cold storage and hot instrument interiors. The 8Mbit array stores bootloader, calibration tables, and GUI firmware; the 55 ns access time keeps instrument self-test and startup under one second without shadow RAM. The bottom boot blocks isolate calibration constants so a failed field firmware update never destroys factory calibration - a critical reliability pattern in metrology. The embedded program/erase controller simplifies the update manager because software only issues commands and polls status rather than timing program pulses. Designers should implement a checksum on each block after programming and reserve one boot block as a recovery image slot to guarantee serviceability.
Recommended
Motor Drive and Power Converter Control Boards
Motor-drive control boards in industrial automation often run 5V microcontroller buses in electrically noisy environments, and the M29F800FB55N3F2's 5V CMOS interface gives superior noise margins versus 3.3V memory on shared boards with high dv/dt switching. Its -40C to +125C rating suits drive enclosures near heat sinks, and AEC-Q100 qualification provides component-level confidence for demanding reliability programs. Firmware resides in the 8Mbit array executing at 55 ns access, while the bottom boot region holds safety-state parameters updated on every fault event. The embedded program/erase controller allows parameter logging between PWM cycles without CPU-side timing routines. Engineers should place the device away from gate-driver loops and add a local 100 nF decoupling capacitor per VCC pin plus bulk capacitance to ride through erase-current spikes.
Recommended
Legacy System Repair and EOL Replacement
The M29F800FB55N3F2 is a natural fit for sustaining legacy systems whose original 5V parallel NOR Flash has gone end-of-life, because it preserves 5V electrical timing, 55 ns access, 48-pin TSOP1 footprint, and bottom boot block mapping without PCB redesign. Maintenance engineers can drop it into schematics designed around the original ST/Numonyx M29F800FB, reprogram the image with standard programmers supporting the command set, and restore fielded equipment to service. For mixed populations, keep both 8-bit and 16-bit hardware configurations in mind - BYTE# strapping must match the original board. The automotive AEC-Q100 grade also serves industrial-repair niches needing extended temperature margin. Always verify programming algorithm support and erase-block map against the current Micron datasheet before reflashing legacy images.
Recommended
Recommended Products Summary
Engineering reference data for M29F800FB55N3F2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M29F800FB55M3F2 | M29F800FT55M3E2 | M29F160FB55N3F2 | M29F160FT55N3F2 |
|---|---|---|---|---|---|
| Package | 48-pin TSOP1 | 48-pin TSOP1-class (verify variant) | 48-pin TSOP1 - same | 48-pin TSOP1 - same | 48-pin TSOP1 - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Density | 8 Mbit | 8 Mbit | 8 Mbit | 16 Mbit | 16 Mbit |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Access Time | 55 ns | 55 ns | 55 ns | 55 ns | 55 ns |
| Boot Block Architecture | Bottom Boot | Bottom Boot | Top Boot | Bottom Boot | Top Boot |
| Organization | 1M x 8 / 512K x 16 | 1M x 8 / 512K x 16 | 1M x 8 / 512K x 16 | 2M x 8 / 1M x 16 | 2M x 8 / 1M x 16 |
| Temperature Range | -40C to +125C (automotive) | [DATA_NEEDED] | [DATA_NEEDED] | -40C to +125C | -40C to +125C |
| Packaging | Tape & Reel | Tape & Reel | Tray (E2 suffix) | Tape & Reel | Tape & Reel |
Key Differentiators
- Bottom boot block map for boot-code designs (vs M29F800FT55M3E2)
- Automotive AEC-Q100 temperature grade (vs Commercial-grade 8Mbit 5V NOR)
- Density upgrade path on identical footprint (vs M29F160FB55N3F2)
- Native 5V single-supply operation (vs M29W800FB70N3F)
Design Notes
The 48-pin TSOP1 outline is a fine-pitch (0.5 mm lead pitch) surface-mount package. Route the 19 address lines and 16 data lines as a managed bus with matched lengths where the processor bus exceeds 25 MHz effective; below that, straight point-to-point routing is acceptable. Place a 100 nF ceramic decoupling capacitor at each VCC pin pair and one 4.7 uF to 10 uF bulk capacitor per device - erase and program operations draw transient current peaks that a single small cap cannot source without VCC droop, which can corrupt the program/erase controller state.
The BYTE# pin determines 8-bit vs 16-bit organization and must never float - tie it hard to VCC (16-bit) or GND (8-bit) per the firmware linker map. The RP# (reset/power-down) pin must be actively driven during power-up; leaving it uncontrolled is a leading cause of spurious writes during brownout, and a simple RC plus supervisor output is recommended. Additionally, ensure the WP# pin is at the intended level before any erase cycle, since write-protect state changes which blocks are modifiable.
This is a single-rail 5V device - no separate program/erase supply is needed because the embedded charge pump generates internal high voltage. Estimated: at 5V VCC with typical read current in the tens-of-mA range (exact value per the datasheet DC table), read-mode power stays near 100 mW, but program/erase phases draw noticeably more current for the duration of the algorithm; verify your 5V regulator headroom against the datasheet VCC current during program/erase, not just read mode, especially in multi-device shared-rail designs.
When reusing this device as a drop-in for legacy 5V NOR, confirm output timing against your bus: the 55 ns access time assumes the datasheet test load. Long bus traces (>15 cm) or heavily loaded multidrop buses add propagation and capacitive loading that effectively consume the timing margin; add wait states in the memory controller rather than exceeding address-valid-to-data-valid limits. For 3.3V hosts, level translation is mandatory - do not attempt to run the bus at reduced VCC, as program/erase reliability depends on the full 5V rail.
Compliance Information
JESD-609 termination code e3 confirms lead-free matte-tin finish per distributor parametric data (Partstack). Automotive temperature grade and AEC-Q100 qualification per datasheets.com and Jotrin listings. Formal REACH and halogen-free declarations should be requested from Micron.