M7AFS600-FGG256 vs AFS600-FGG256 Comparison

Detailed side-by-side comparison of M7AFS600-FGG256 by Microchip Technology and AFS600-FGG256 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M7AFS600-FGG256 M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip

M7AFS600-FGG256 ✓ Active
Microchip Technology
AFS600-FGG256 AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FGG256 Unknown

Specification Comparison

Parameter M7AFS600-FGG256 AFS600-FGG256
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Unknown
Family Fusion (M7AFS600) —
System Gates 600K 600,000 gates
Flip-Flops 110592 —
User I/O 119 —
Embedded Processor ARM CoreMP7 —
Core Supply Voltage 1.5 V —
Process Technology 130 nm flash-based 130 nm
Maximum Frequency 1098.9 MHz (distributor listing) —
Package 256-LBGA / 256-FBGA —
Ball Pitch 1 mm —
Mounting Type Surface Mount Surface mount
Configuration Memory Flash (single-chip, non-volatile) Flash-based nonvolatile memory
Analog Features Integrated configurable analog blocks, clock generation and management —
Operating Temperature [DATA_NEEDED: Operating Temperature Range] 0°C to 70°C
Packaging Tray —
RoHS Status [DATA_NEEDED: RoHS Status] —
MSL Level [DATA_NEEDED: Moisture Sensitivity Level] —
Device Type — Fusion mixed-signal FPGA
Configurable Logic Cells — 13,824 cells
I/O Count — 119 I/Os
Supply Voltage — 1.5 V
Logic Family — CMOS
Metal Layers — 7 layers
Configuration Feature — Live at Power-Up (LAPU)
Maximum Clock Frequency — 1098.9 MHz
Package Type — 256-pin FBGA
Package Pitch — 1.0 mm
Packing Media — Tray
RoHS — Compliant

Datasheets & Resources

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