M7AFS600-FGG256 vs AFS600-FGG256 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M7AFS600-FGG256 disebabkan oleh Microchip Technology dan AFS600-FGG256 disebabkan oleh Microchip Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ Aktif
Pengandingan Spesifikasi
| Parametr | M7AFS600-FGG256 | AFS600-FGG256 |
|---|---|---|
| Merek | Microchip Technology | Microchip Technology |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Unknown |
| Family | Fusion (M7AFS600) | — |
| System Gates | 600K | 600,000 gates |
| Flip-Flops | 110592 | — |
| User I/O | 119 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | 130 nm |
| Maximum Frequency | 1098.9 MHz (distributor listing) | — |
| Kemasan | 256-LBGA / 256-FBGA | — |
| Ball Pitch | 1 mm | — |
| Jenis Pemasangan | Surface Mount | Surface mount |
| Configuration Memory | Flash (single-chip, non-volatile) | Flash-based nonvolatile memory |
| Analog Features | Integrated configurable analog blocks, clock generation and management | — |
| Suhu Operasi | [DATA_NEEDED: Operating Temperature Range] | 0°C to 70°C |
| Packaging | Tray | — |
| Status RoHS | [DATA_NEEDED: RoHS Status] | — |
| Aras MSL | [DATA_NEEDED: Moisture Sensitivity Level] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Cells | — | 13,824 cells |
| I/O Count | — | 119 I/Os |
| Tegangan Pemberi Arus | — | 1.5 V |
| Logic Family | — | CMOS |
| Metal Layers | — | 7 layers |
| Configuration Feature | — | Live at Power-Up (LAPU) |
| Frekuensi Klock Maksimum | — | 1098.9 MHz |
| Package Type | — | 256-pin FBGA |
| Package Pitch | — | 1.0 mm |
| Packing Media | — | Tray |
| RoHS | — | Compliant |