M7AFS600-FGG256 vs AFS600-FGG256 Vergleich
Detaillierter Direktvergleich von M7AFS600-FGG256 von Microchip Technology und AFS600-FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ Aktiv
Spezifikationsvergleich
| Parameter | M7AFS600-FGG256 | AFS600-FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Unknown |
| Family | Fusion (M7AFS600) | — |
| System Gates | 600K | 600,000 gates |
| Flip-Flops | 110592 | — |
| User I/O | 119 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | 130 nm |
| Maximum Frequency | 1098.9 MHz (distributor listing) | — |
| Gehäuse | 256-LBGA / 256-FBGA | — |
| Ball Pitch | 1 mm | — |
| Montageart | Surface Mount | Surface mount |
| Configuration Memory | Flash (single-chip, non-volatile) | Flash-based nonvolatile memory |
| Analog Features | Integrated configurable analog blocks, clock generation and management | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | 0°C to 70°C |
| Packaging | Tray | — |
| RoHS-Status | [DATA_NEEDED: RoHS Status] | — |
| MSL-Level | [DATA_NEEDED: Moisture Sensitivity Level] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Configurable Logic Cells | — | 13,824 cells |
| I/O Count | — | 119 I/Os |
| Versorgungsspannung | — | 1.5 V |
| Logic Family | — | CMOS |
| Metal Layers | — | 7 layers |
| Configuration Feature | — | Live at Power-Up (LAPU) |
| Maximale Taktfrequenz | — | 1098.9 MHz |
| Package Type | — | 256-pin FBGA |
| Package Pitch | — | 1.0 mm |
| Packing Media | — | Tray |
| RoHS | — | Compliant |