MC34903CP3EK vs MC34903CP5EK Comparison

Detailed side-by-side comparison of MC34903CP3EK by NXP Semiconductors and MC34903CP5EK by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC34903CP3EK MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP

MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP

MC34903CP3EK ✗ End of Life
NXP Semiconductors
MC34903CP5EK MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP

MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP

MC34903CP5EK ⚠ Last Time Buy

Specification Comparison

Parameter MC34903CP3EK MC34903CP5EK
Brand NXP Semiconductors NXP Semiconductors
Category Power Management Specialized PMIC
Lifecycle Status End of Life Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $5.42 $2.58
Function System Basis Chip (SBC) - PMIC + CAN + LIN —
Topology Dual LDO + high-side switches + CAN/LIN transceivers —
Number of Outputs 2 LDOs + multiple high-side drivers —
LDO Output Voltage 3.3 V (x2) 5.0 V (typ)
LDO Output Current 400 mA per LDO —
CAN Interface 1 Mbps, ISO 11898 compliant High-Speed CAN (ISO 11898-2/5), up to 1 Mbaud
LIN Interface LIN 2.0 slave —
Wake-up Inputs 3 (cyclic and edge-triggered) —
Supply Voltage Range 9 V to 18 V nominal (5.5 V to 40 V transient) —
Operating Temperature -40C to +125C —
Package 32-SOIC-EP (exposed pad) —
Mounting Type Surface Mount Surface Mount
MSL Level 3 (168 hours) 3 (per JEDEC J-STD-020)
Configuration Interface SPI / SCI —
Thermal Shutdown Integrated —
Lifecycle Status End of Life (per NXP product page) —
RoHS Status Compliant Compliant
Product Type — System Basis Chip (SBC) with dual LDO + HS-CAN
Number of LDOs — 2
LDO Output Current (each) — 400 mA
Input Voltage Range — 5.5 V to 28 V
Load Dump Tolerance — 40 V (max)
Quiescent Current (standby) — 2 mA (typ)
Number of Wake-up Inputs — 3
Communication Interface — SPI (control/status)
Operating Temperature Range — -40 °C to +125 °C
Package Type — SOIC-32 (exposed pad, 7.5 mm body)
Automotive Qualification — AEC-Q100 qualified

Datasheets & Resources

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