MC68EN360AI25L vs MC68EN360AI33L-FR Comparison

Detailed side-by-side comparison of MC68EN360AI25L by NXP Semiconductors and MC68EN360AI33L-FR by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC68EN360AI25L MC68EN360AI25L - QUICC M683xx 32-Bit MPU 25MHz | NXP

MC68EN360AI25L - QUICC M683xx 32-Bit MPU 25MHz | NXP

MC68EN360AI25L ⚠ Last Time Buy
NXP Semiconductors
MC68EN360AI33L-FR MC68EN360AI33L-FR - 33MHz CPU32+ QUICC MPU 240-FQFP | Freescale

MC68EN360AI33L-FR - 33MHz CPU32+ QUICC MPU 240-FQFP | Freescale

MC68EN360AI33L-FR Obsolete

Specification Comparison

Parameter MC68EN360AI25L MC68EN360AI33L-FR
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Obsolete
Core Architecture CPU32+ (M68000 family) —
Number of Cores 1 1 Core, 32-Bit
Data Bus Width 32-bit —
Maximum Clock Frequency 25 MHz —
Supply Voltage 5 V (5.0 V nominal, 5.25 V max) —
Integrated Ethernet MAC Yes (10 Mbps, EN variant) —
Serial Communication Controllers (SCCs) 4 —
Serial Management Controllers (SMCs) 2 —
Package Type 240-BFQFP (FQFP-240, 32 x 32 mm) —
Mounting Style Surface Mount —
Operating Temperature [DATA_NEEDED: operating temperature range] —
Packaging Media Tray —
Lead Free Status Lead Free Lead Free
RoHS Status RoHS Compliant Compliant
Product Family QUICC (QUad Integrated Communication Controller) —
Core Processor — CPU32+
Speed / Clock Frequency — 33 MHz
Operating Voltage — 5 V
Co-Processors / DSP — Communications Processor Module (CPM); SCC x4, SMC x2, SPI x1
Ethernet — 10 Mbps (MII)
RAM Controllers — DRAM
Package / Case — 240-FQFP (32 x 32 mm)
Packaging — Tray
Mounting Type — Surface Mount
Process Technology — 0.57 um CMOS
Pin Count — 240
Product Status — Not For New Designs (EOL)

Datasheets & Resources

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