MC7448HX1250ND vs MC7448HX1000ND Comparison
Detailed side-by-side comparison of MC7448HX1250ND by NXP Semiconductors and MC7448HX1000ND by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP
MC7448HX1000ND ✗ End of LifeSpecification Comparison
| Parameter | MC7448HX1250ND | MC7448HX1000ND |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Obsolete | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $360.00 | $235.80 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 (PowerPC G4) | — |
| Core Architecture | 32-bit Power Architecture (PowerPC G4) | 32-bit PowerPC (Book E), superscalar, out-of-order |
| Core Count | 1 | — |
| Maximum Core Frequency | 1.25 GHz | — |
| L2 Cache Size | 1 MB (unified, on-chip) | — |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) | 90 nm SOI (silicon-on-insulator) |
| System Bus | MPX/60x, up to 200 MHz | — |
| SIMD Engine | AltiVec (VMX) | AltiVec (VMX), 128-bit |
| Core Voltage (Vdd) | 1.1 V | — |
| Operating Temperature | -40C to +105C | — |
| Package | 360-ball FCCBGA (25x25 mm) | 360-FCCBGA (25 x 25 mm) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Family | — | PowerPC G4 / MPC74xx |
| Core Frequency | — | 1.0 GHz |
| System Bus (MPX/60x) | — | Up to 200 MHz DDR (64-bit) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| L2 Cache | — | 1 MB on-chip, victim-replacement |
| Core Voltage | — | 1.0 V (+/- 50 mV) |
| I/O Voltage | — | [DATA_NEEDED: I/O supply nominal] |
| Junction Operating Temperature | — | -40C to +105C |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead (per DigiChip summary) |
| MPN Decode (HX) | — | H = 1.0 V core, X = tape-and-reel packaging code suffix |
| Lifecycle | — | End of Life (per NXP product page header) |