MC7448HX1250ND vs MC7448HX1000ND Сравнение
Подробное сравнение бок о бок MC7448HX1250ND от NXP Semiconductors и MC7448HX1000ND от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP
MC7448HX1000ND ✗ Снят с производстваСравнение характеристик
| Параметр | MC7448HX1250ND | MC7448HX1000ND |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Obsolete | Снято с производства |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $360,00 | $235,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 (PowerPC G4) | — |
| Core Architecture | 32-bit Power Architecture (PowerPC G4) | 32-bit PowerPC (Book E), superscalar, out-of-order |
| Core Count | 1 | — |
| Maximum Core Frequency | 1.25 GHz | — |
| L2 Cache Size | 1 MB (unified, on-chip) | — |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) | 90 nm SOI (silicon-on-insulator) |
| System Bus | MPX/60x, up to 200 MHz | — |
| SIMD Engine | AltiVec (VMX) | AltiVec (VMX), 128-bit |
| Core Voltage (Vdd) | 1.1 V | — |
| Рабочая температура | -40C to +105C | — |
| Корпус | 360-ball FCCBGA (25x25 mm) | 360-FCCBGA (25 x 25 mm) |
| Тип монтажа | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| Уровень MSL | [DATA_NEEDED: MSL level] | — |
| Статус RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Family | — | PowerPC G4 / MPC74xx |
| Core Frequency | — | 1.0 GHz |
| System Bus (MPX/60x) | — | Up to 200 MHz DDR (64-bit) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| L2 Cache | — | 1 MB on-chip, victim-replacement |
| Core Voltage | — | 1.0 V (+/- 50 mV) |
| I/O Voltage | — | [DATA_NEEDED: I/O supply nominal] |
| Junction Operating Temperature | — | -40C to +105C |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead (per DigiChip summary) |
| MPN Decode (HX) | — | H = 1.0 V core, X = tape-and-reel packaging code suffix |
| Lifecycle | — | End of Life (per NXP product page header) |