MC7448HX1250ND vs MC7448HX1000ND Comparaison

Comparaison détaillée côte à côte de MC7448HX1250ND par NXP Semiconductors et MC7448HX1000ND par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MC7448HX1250ND MC7448HX1250ND - PowerPC G4 MPU 1.25GHz 1MB L2 | NXP

MC7448HX1250ND - PowerPC G4 MPU 1.25GHz 1MB L2 | NXP

MC7448HX1250ND Obsolete
NXP Semiconductors
MC7448HX1000ND MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP

MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP

MC7448HX1000ND ✗ Fin de vie

Comparaison des spécifications

Paramètre MC7448HX1250ND MC7448HX1000ND
Marque NXP Semiconductors NXP Semiconductors
Catégorie Microcontrollers Microcontrollers
Statut du cycle de vie Obsolete Fin de vie
Statut du stock In Stock In Stock
Prix unitaire (USD) $360,00 $235,80
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale)
Part Series MPC7448 (PowerPC G4) —
Core Architecture 32-bit Power Architecture (PowerPC G4) 32-bit PowerPC (Book E), superscalar, out-of-order
Core Count 1 —
Maximum Core Frequency 1.25 GHz —
L2 Cache Size 1 MB (unified, on-chip) —
Process Technology 90 nm Silicon-on-Insulator (SOI) 90 nm SOI (silicon-on-insulator)
System Bus MPX/60x, up to 200 MHz —
SIMD Engine AltiVec (VMX) AltiVec (VMX), 128-bit
Core Voltage (Vdd) 1.1 V —
Température de fonctionnement -40C to +105C —
Boîtier 360-ball FCCBGA (25x25 mm) 360-FCCBGA (25 x 25 mm)
Type de montage Surface Mount (BGA) Surface Mount (flip-chip BGA)
Niveau MSL [DATA_NEEDED: MSL level] —
Statut RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
Lead-Free [DATA_NEEDED: lead-free status] —
Processor Family — PowerPC G4 / MPC74xx
Core Frequency — 1.0 GHz
System Bus (MPX/60x) — Up to 200 MHz DDR (64-bit)
L1 Cache — 32 KB instruction + 32 KB data
L2 Cache — 1 MB on-chip, victim-replacement
Core Voltage — 1.0 V (+/- 50 mV)
I/O Voltage — [DATA_NEEDED: I/O supply nominal]
Junction Operating Temperature — -40C to +105C
Packaging — Tray
Lead-Free Status — Contains Lead (per DigiChip summary)
MPN Decode (HX) — H = 1.0 V core, X = tape-and-reel packaging code suffix
Lifecycle — End of Life (per NXP product page header)

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