MC7448HX1250ND vs MC7448HX1000ND Vergleich
Detaillierter Direktvergleich von MC7448HX1250ND von NXP Semiconductors und MC7448HX1000ND von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC7448HX1000ND - PowerPC G4 MPU 1GHz 1MB L2 AltiVec | NXP
MC7448HX1000ND ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MC7448HX1250ND | MC7448HX1000ND |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $360,00 | $235,80 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Part Series | MPC7448 (PowerPC G4) | — |
| Core Architecture | 32-bit Power Architecture (PowerPC G4) | 32-bit PowerPC (Book E), superscalar, out-of-order |
| Core Count | 1 | — |
| Maximum Core Frequency | 1.25 GHz | — |
| L2 Cache Size | 1 MB (unified, on-chip) | — |
| Process Technology | 90 nm Silicon-on-Insulator (SOI) | 90 nm SOI (silicon-on-insulator) |
| System Bus | MPX/60x, up to 200 MHz | — |
| SIMD Engine | AltiVec (VMX) | AltiVec (VMX), 128-bit |
| Core Voltage (Vdd) | 1.1 V | — |
| Betriebstemperatur | -40C to +105C | — |
| Gehäuse | 360-ball FCCBGA (25x25 mm) | 360-FCCBGA (25 x 25 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount (flip-chip BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Processor Family | — | PowerPC G4 / MPC74xx |
| Core Frequency | — | 1.0 GHz |
| System Bus (MPX/60x) | — | Up to 200 MHz DDR (64-bit) |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| L2 Cache | — | 1 MB on-chip, victim-replacement |
| Core Voltage | — | 1.0 V (+/- 50 mV) |
| I/O Voltage | — | [DATA_NEEDED: I/O supply nominal] |
| Junction Operating Temperature | — | -40C to +105C |
| Packaging | — | Tray |
| Lead-Free Status | — | Contains Lead (per DigiChip summary) |
| MPN Decode (HX) | — | H = 1.0 V core, X = tape-and-reel packaging code suffix |
| Lifecycle | — | End of Life (per NXP product page header) |