MC8641DTVU1000GE vs MC8641DTHX1333JE Comparison

Detailed side-by-side comparison of MC8641DTVU1000GE by NXP Semiconductors and MC8641DTHX1333JE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC8641DTVU1000GE MC8641DTVU1000GE - Dual-Core 1GHz PowerPC SoC | NXP

MC8641DTVU1000GE - Dual-Core 1GHz PowerPC SoC | NXP

MC8641DTVU1000GE ⚠ Last Time Buy
NXP Semiconductors
MC8641DTHX1333JE MC8641DTHX1333JE - PowerPC e600 Dual-Core 1.333GHz MPU | NXP

MC8641DTHX1333JE - PowerPC e600 Dual-Core 1.333GHz MPU | NXP

MC8641DTHX1333JE Obsolete

Specification Comparison

Parameter MC8641DTVU1000GE MC8641DTHX1333JE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $295.00 $445.00
Processor Type PowerPC e600 (MPC86xx) Dual-Core SoC —
Number of Cores 2 2
Core Architecture Superscalar e600, 32-bit, 3-issue / 7-stage pipeline —
Core Frequency 1.0 GHz —
SIMD Engine AltiVec per core —
Core Supply Voltage 1.05 V (0.95 V variant per part suffix) —
I/O Supply Voltages 1.8 V / 2.5 V / 3.3 V —
Operating Temperature -40C to +105C -40C to +105C
Silicon Revision Rev 3.0 (G8) G8 REV 3.0
Memory Controller Integrated DDR1/DDR2 with ECC —
Integrated MACs Gigabit Ethernet (GbE) —
PCI Express PCIe interfaces integrated —
Serial RapidIO (SRIO) Integrated SRIO fabric —
Package 1023-ball FCCBGA (33x33 mm) 1023-ball FCCBGA (33x33 mm)
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Process Technology 0.09 um CMOS —
RoHS Status Compliant (per distributor listings) RoHS non-compliant (Sn/Pb finish)
Core Processor — PowerPC e600
Series — MPC86xx
Data Bus Width — 32-Bit
Speed — 1.333 GHz
Core Voltage — 0.95 V
RAM Controllers — DDR, DDR2
Graphics Acceleration — No
Ethernet — 10/100/1000 Mbps (dual MAC)
Display & Interface Controllers — Not specified
Co-Processors / DSP — Not specified
Terminal Finish — Tin/Lead (Sn/Pb)
Peak Reflow Temperature — 245 C (max 30 s)
Technology — CMOS
Part Status — Obsolete

Datasheets & Resources

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