MC8641DTVU1000GE vs MC8641DTHX1333JE Vergleich

Detaillierter Direktvergleich von MC8641DTVU1000GE von NXP Semiconductors und MC8641DTHX1333JE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC8641DTVU1000GE MC8641DTVU1000GE - Dual-Core 1GHz PowerPC SoC | NXP

MC8641DTVU1000GE - Dual-Core 1GHz PowerPC SoC | NXP

MC8641DTVU1000GE ⚠ Letzte Bestellmöglichkeit
NXP Semiconductors
MC8641DTHX1333JE MC8641DTHX1333JE - PowerPC e600 Dual-Core 1.333GHz MPU | NXP

MC8641DTHX1333JE - PowerPC e600 Dual-Core 1.333GHz MPU | NXP

MC8641DTHX1333JE Obsolete

Spezifikationsvergleich

Parameter MC8641DTVU1000GE MC8641DTHX1333JE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Letzte Kaufgelegenheit Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $295,00 $445,00
Processor Type PowerPC e600 (MPC86xx) Dual-Core SoC —
Number of Cores 2 2
Core Architecture Superscalar e600, 32-bit, 3-issue / 7-stage pipeline —
Core Frequency 1.0 GHz —
SIMD Engine AltiVec per core —
Core Supply Voltage 1.05 V (0.95 V variant per part suffix) —
I/O Supply Voltages 1.8 V / 2.5 V / 3.3 V —
Betriebstemperatur -40C to +105C -40C to +105C
Silicon Revision Rev 3.0 (G8) G8 REV 3.0
Memory Controller Integrated DDR1/DDR2 with ECC —
Integrated MACs Gigabit Ethernet (GbE) —
PCI Express PCIe interfaces integrated —
Serial RapidIO (SRIO) Integrated SRIO fabric —
Gehäuse 1023-ball FCCBGA (33x33 mm) 1023-ball FCCBGA (33x33 mm)
Montageart Surface Mount (BGA) Surface Mount (BGA)
Process Technology 0.09 um CMOS —
RoHS-Status Compliant (per distributor listings) RoHS non-compliant (Sn/Pb finish)
Core Processor — PowerPC e600
Series — MPC86xx
Datenbusbreite — 32-Bit
Speed — 1.333 GHz
Core Voltage — 0.95 V
RAM Controllers — DDR, DDR2
Graphics Acceleration — No
Ethernet — 10/100/1000 Mbps (dual MAC)
Display & Interface Controllers — Not specified
Co-Processors / DSP — Not specified
Terminal Finish — Tin/Lead (Sn/Pb)
Peak Reflow Temperature — 245 C (max 30 s)
Technology — CMOS
Part Status — Obsolete

Datenblätter & Ressourcen

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