MC9S08AW16CPUE vs MC9S08AW48CPUE Comparison
Detailed side-by-side comparison of MC9S08AW16CPUE by NXP Semiconductors and MC9S08AW48CPUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08AW16CPUE | MC9S08AW48CPUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.20 | $0.00 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Core Architecture | CISC | — |
| Maximum Clock Frequency | 40 MHz (CPU) / 20 MHz (bus) | — |
| Program Memory Size | 16KB (16K x 8) | 48 KB (48K x 8) |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 1K x 8 | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Operating Temperature | -40C to +85C | [DATA_NEEDED: operating temperature range] |
| ADC Resolution | 10-bit | — |
| ADC Channels | 16 | — |
| I/O Ports | 38 | — |
| Oscillator Type | Internal | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Package | 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | — |
| Mounting Type | Surface Mount | Surface Mount |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| I/O Count | — | 38 |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Packaging | — | Tray |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |