MC9S08AW16CPUE vs MC9S08AW48CPUE 对比
详细并排对比 MC9S08AW16CPUE 出自 NXP Semiconductors 和 MC9S08AW48CPUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08AW16CPUE | MC9S08AW48CPUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.20 | $0.00 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Core Architecture | CISC | — |
| 最大时钟频率 | 40 MHz (CPU) / 20 MHz (bus) | — |
| Program Memory Size | 16KB (16K x 8) | 48 KB (48K x 8) |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 1K x 8 | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| 工作温度 | -40C to +85C | [DATA_NEEDED: operating temperature range] |
| ADC Resolution | 10-bit | — |
| ADC Channels | 16 | — |
| I/O Ports | 38 | — |
| Oscillator Type | Internal | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| 封装 | 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | — |
| 安装类型 | Surface Mount | Surface Mount |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| I/O Count | — | 38 |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Packaging | — | Tray |
| 生命周期状态 | — | NRND (Not Recommended for New Designs) |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |