MC9S08AW16CPUE vs MC9S08AW48CPUE Vergleich
Detaillierter Direktvergleich von MC9S08AW16CPUE von NXP Semiconductors und MC9S08AW48CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW16CPUE | MC9S08AW48CPUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,20 | $0,00 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Core Architecture | CISC | — |
| Maximale Taktfrequenz | 40 MHz (CPU) / 20 MHz (bus) | — |
| Program Memory Size | 16KB (16K x 8) | 48 KB (48K x 8) |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 1K x 8 | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Betriebstemperatur | -40C to +85C | [DATA_NEEDED: operating temperature range] |
| ADC Resolution | 10-bit | — |
| ADC Channels | 16 | — |
| I/O Ports | 38 | — |
| Oscillator Type | Internal | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Gehäuse | 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | — |
| Montageart | Surface Mount | Surface Mount |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| I/O Count | — | 38 |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Packaging | — | Tray |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |