MC9S08AW16CPUE vs MC9S08AW48CPUE Comparación
Comparación detallada lado a lado de MC9S08AW16CPUE por NXP Semiconductors y MC9S08AW48CPUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AW16CPUE | MC9S08AW48CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,20 | $0,00 |
| Core Processor | S08 (HCS08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Core Architecture | CISC | — |
| Frecuencia de reloj máxima | 40 MHz (CPU) / 20 MHz (bus) | — |
| Program Memory Size | 16KB (16K x 8) | 48 KB (48K x 8) |
| Program Memory Type | FLASH | FLASH |
| RAM Size | 1K x 8 | [DATA_NEEDED: RAM size] |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Temperatura de funcionamiento | -40C to +85C | [DATA_NEEDED: operating temperature range] |
| ADC Resolution | 10-bit | — |
| ADC Channels | 16 | — |
| I/O Ports | 38 | — |
| Oscillator Type | Internal | — |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Encapsulado | 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| I/O Count | — | 38 |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Packaging | — | Tray |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |