MC9S08DN60MLF vs MC9S08AC16MFJE Comparison
Detailed side-by-side comparison of MC9S08DN60MLF by NXP Semiconductors and MC9S08AC16MFJE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP
MC9S08DN60MLF [data_needed: lifecycle status]
Specification Comparison
| Parameter | MC9S08DN60MLF | MC9S08AC16MFJE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | [DATA NEEDED: Lifecycle Status] | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $0.00 | $0.00 |
| Product Type | 8-bit HCS08 embedded microcontroller | — |
| Program Memory Size | 60 KB (60K x 8) flash | — |
| RAM Size | 2 KB (2K x 8) | — |
| CPU Speed | 40 MHz | — |
| Bus Speed | 20 MHz | — |
| Architecture | HCS08 CPU with HC08 instruction set and BGND instruction | — |
| Number of I/O | 39 | — |
| ADC Channels | 16 channels | — |
| ADC Resolution | 12-bit | — |
| ADC Conversion Time | 2.5 microseconds | — |
| Oscillator Type | External oscillator | — |
| Interrupt/Reset Sources | Up to 32 interrupt/reset sources | — |
| Package | 48-LQFP (7x7 mm) | 32-LQFP, 7 mm x 7 mm |
| Mounting Type | Surface-mount gull-wing package | — |
| Temperature Grade | Automotive | Automotive |
| Packaging | Tray | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | RoHS compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| CAN Controller | No CAN | — |
| Flash Read/Program/Erase | Supported over full operating voltage and temperature | — |
| Core Architecture | — | S08 8-bit HCS08 core |
| Maximum Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory | — | 16 KB Flash |
| RAM | — | 4K x 8 RAM |
| Supply Voltage | — | 2.7 V to 5.5 V |
| Serial Interfaces | — | I2C, SCI, SPI |
| Peripheral Features | — | LVD, POR, PWM, WDT |
| I/O Count | — | 22 I/O |
| Package Type | — | Surface-mount LQFP |
| Lifecycle Status | — | Active according to secondary technical listing; NXP page indicates End of Life overview |
| Core Processor | — | S08 |
| Program Memory Organization | — | 16K x 8 Flash |
| EEPROM | — | Not specified in supplied data |
| ADC | — | Not specified in supplied data |
| Operating Temperature | — | Not specified in supplied data |