MC9S08DN60MLF vs MC9S08AC16MFJE Comparación
Comparación detallada lado a lado de MC9S08DN60MLF por NXP Semiconductors y MC9S08AC16MFJE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP
MC9S08DN60MLF [data_needed: lifecycle status]
Comparación de especificaciones
| Parámetro | MC9S08DN60MLF | MC9S08AC16MFJE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | [DATA NEEDED: Lifecycle Status] | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,00 |
| Product Type | 8-bit HCS08 embedded microcontroller | — |
| Program Memory Size | 60 KB (60K x 8) flash | — |
| RAM Size | 2 KB (2K x 8) | — |
| CPU Speed | 40 MHz | — |
| Bus Speed | 20 MHz | — |
| Architecture | HCS08 CPU with HC08 instruction set and BGND instruction | — |
| Number of I/O | 39 | — |
| ADC Channels | 16 channels | — |
| ADC Resolution | 12-bit | — |
| ADC Conversion Time | 2.5 microseconds | — |
| Oscillator Type | External oscillator | — |
| Interrupt/Reset Sources | Up to 32 interrupt/reset sources | — |
| Encapsulado | 48-LQFP (7x7 mm) | 32-LQFP, 7 mm x 7 mm |
| Tipo de montaje | Surface-mount gull-wing package | — |
| Temperature Grade | Automotive | Automotive |
| Packaging | Tray | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| CAN Controller | No CAN | — |
| Flash Read/Program/Erase | Supported over full operating voltage and temperature | — |
| Core Architecture | — | S08 8-bit HCS08 core |
| Maximum Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory | — | 16 KB Flash |
| RAM | — | 4K x 8 RAM |
| Tensión de alimentación | — | 2.7 V to 5.5 V |
| Serial Interfaces | — | I2C, SCI, SPI |
| Peripheral Features | — | LVD, POR, PWM, WDT |
| I/O Count | — | 22 I/O |
| Package Type | — | Surface-mount LQFP |
| Estado del ciclo de vida | — | Active according to secondary technical listing; NXP page indicates End of Life overview |
| Core Processor | — | S08 |
| Program Memory Organization | — | 16K x 8 Flash |
| EEPROM | — | Not specified in supplied data |
| ADC | — | Not specified in supplied data |
| Temperatura de funcionamiento | — | Not specified in supplied data |