MC9S08DN60MLF vs MC9S08AC16MFJE Comparaison

Comparaison détaillée côte à côte de MC9S08DN60MLF par NXP Semiconductors et MC9S08AC16MFJE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MC9S08DN60MLF MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP

MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP

MC9S08DN60MLF [data_needed: lifecycle status]
NXP Semiconductors
MC9S08AC16MFJE MC9S08AC16MFJE - 40MHz 16KB 8-Bit MCU | NXP

MC9S08AC16MFJE - 40MHz 16KB 8-Bit MCU | NXP

MC9S08AC16MFJE Nrnd

Comparaison des spécifications

Paramètre MC9S08DN60MLF MC9S08AC16MFJE
Marque NXP Semiconductors NXP Semiconductors
Catégorie Microcontrollers Microcontrollers
Statut du cycle de vie [DATA NEEDED: Lifecycle Status] NRND
Statut du stock In Stock In Stock
Prix unitaire (USD) $0,00 $0,00
Product Type 8-bit HCS08 embedded microcontroller —
Program Memory Size 60 KB (60K x 8) flash —
RAM Size 2 KB (2K x 8) —
CPU Speed 40 MHz —
Bus Speed 20 MHz —
Architecture HCS08 CPU with HC08 instruction set and BGND instruction —
Number of I/O 39 —
ADC Channels 16 channels —
ADC Resolution 12-bit —
ADC Conversion Time 2.5 microseconds —
Oscillator Type External oscillator —
Interrupt/Reset Sources Up to 32 interrupt/reset sources —
Boîtier 48-LQFP (7x7 mm) 32-LQFP, 7 mm x 7 mm
Type de montage Surface-mount gull-wing package —
Temperature Grade Automotive Automotive
Packaging Tray —
Statut RoHS [DATA_NEEDED: RoHS status] RoHS compliant
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
CAN Controller No CAN —
Flash Read/Program/Erase Supported over full operating voltage and temperature —
Core Architecture — S08 8-bit HCS08 core
Maximum Clock Speed — 40 MHz
Internal Bus Frequency — 20 MHz
Program Memory — 16 KB Flash
RAM — 4K x 8 RAM
Tension d'alimentation — 2.7 V to 5.5 V
Serial Interfaces — I2C, SCI, SPI
Peripheral Features — LVD, POR, PWM, WDT
I/O Count — 22 I/O
Package Type — Surface-mount LQFP
Statut du cycle de vie — Active according to secondary technical listing; NXP page indicates End of Life overview
Core Processor — S08
Program Memory Organization — 16K x 8 Flash
EEPROM — Not specified in supplied data
ADC — Not specified in supplied data
Température de fonctionnement — Not specified in supplied data

Fiches techniques et ressources

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