MC9S08DN60MLF vs MC9S08AC16MFJE Vergleich
Detaillierter Direktvergleich von MC9S08DN60MLF von NXP Semiconductors und MC9S08AC16MFJE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08DN60MLF - 40MHz 8-Bit 60KB MCU | NXP
MC9S08DN60MLF [data_needed: lifecycle status]
Spezifikationsvergleich
| Parameter | MC9S08DN60MLF | MC9S08AC16MFJE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | [DATA NEEDED: Lifecycle Status] | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $0,00 |
| Product Type | 8-bit HCS08 embedded microcontroller | — |
| Program Memory Size | 60 KB (60K x 8) flash | — |
| RAM Size | 2 KB (2K x 8) | — |
| CPU Speed | 40 MHz | — |
| Bus Speed | 20 MHz | — |
| Architecture | HCS08 CPU with HC08 instruction set and BGND instruction | — |
| Number of I/O | 39 | — |
| ADC Channels | 16 channels | — |
| ADC Resolution | 12-bit | — |
| ADC Conversion Time | 2.5 microseconds | — |
| Oscillator Type | External oscillator | — |
| Interrupt/Reset Sources | Up to 32 interrupt/reset sources | — |
| Gehäuse | 48-LQFP (7x7 mm) | 32-LQFP, 7 mm x 7 mm |
| Montageart | Surface-mount gull-wing package | — |
| Temperature Grade | Automotive | Automotive |
| Packaging | Tray | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| CAN Controller | No CAN | — |
| Flash Read/Program/Erase | Supported over full operating voltage and temperature | — |
| Core Architecture | — | S08 8-bit HCS08 core |
| Maximum Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory | — | 16 KB Flash |
| RAM | — | 4K x 8 RAM |
| Versorgungsspannung | — | 2.7 V to 5.5 V |
| Serial Interfaces | — | I2C, SCI, SPI |
| Peripheral Features | — | LVD, POR, PWM, WDT |
| I/O Count | — | 22 I/O |
| Package Type | — | Surface-mount LQFP |
| Lebenszyklusstatus | — | Active according to secondary technical listing; NXP page indicates End of Life overview |
| Core Processor | — | S08 |
| Program Memory Organization | — | 16K x 8 Flash |
| EEPROM | — | Not specified in supplied data |
| ADC | — | Not specified in supplied data |
| Betriebstemperatur | — | Not specified in supplied data |