MC9S08DZ60AMLC vs MC9S08DZ60MLC Comparison

Detailed side-by-side comparison of MC9S08DZ60AMLC by NXP Semiconductors and MC9S08DZ60MLC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08DZ60AMLC MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC Nrnd
NXP Semiconductors
MC9S08DZ60MLC MC9S08DZ60MLC - 8-bit S08DZ MCU, 60KB Flash, 32-LQFP | NXP

MC9S08DZ60MLC - 8-bit S08DZ MCU, 60KB Flash, 32-LQFP | NXP

MC9S08DZ60MLC ✓ Active

Specification Comparison

Parameter MC9S08DZ60AMLC MC9S08DZ60MLC
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $6.15 $5.08
Core HCS08 (CISC, 8-bit) —
CPU Frequency 40 MHz (20 MHz bus) —
Program Memory 60 KB Flash —
RAM 4 KB 4 KB
EEPROM 2 KB —
Supply Voltage 2.7 V to 5.5 V —
ADC 24-channel, 12-bit, 2.5 us conversion 12-bit (channels vary by package)
CAN Interface 1x MSCAN (CAN 2.0A/B) —
SCI / UART 2 —
SPI 1 —
I/O Pins 40 (32-LQFP exposed count varies by mux) —
LCD Driver Up to 8x36 segments —
Timers TPM channels included —
Package 32-LQFP (7x7 mm, 0.5 mm pitch) 32-LQFP (7x7 mm)
Operating Temperature -40 C to +125 C (automotive grade) —
RoHS Status Compliant Compliant (per distributor listings)
MSL Level [DATA_NEEDED: MSL level] —
Core Architecture — HCS08 (S08 family) - 8-bit
CPU Core — HCS08 with HC08 instruction set (plus BGND)
Core Clock Frequency — 40 MHz
Internal Bus Speed — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
EEPROM / Emulated EEPROM — [DATA_NEEDED: EEPROM size]
Mounting Type — Surface Mount (Gull Wing)
Maximum GPIO — 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset)
Number of Pins — 32
Interrupt Sources — Up to 32
CAN Module — MSCAN (CAN 2.0B) - 1 channel
Timers / PWM — Multiple (TPM, PIT family)
Operating Voltage Range — [DATA_NEEDED: VDD min/max]
Operating Temperature Range — -40C to +125C (automotive grade; verify per suffix)
Debug Interface — BDM (Background Debug Mode)
Lead-Free / Halogen-Free — Lead-Free per NXP packaging standards

Datasheets & Resources

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