MC9S08DZ60AMLC vs MC9S08DZ60MLC Сравнение

Подробное сравнение бок о бок MC9S08DZ60AMLC от NXP Semiconductors и MC9S08DZ60MLC от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.

NXP Semiconductors
MC9S08DZ60AMLC MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MC9S08DZ60AMLC Nrnd
NXP Semiconductors
MC9S08DZ60MLC MC9S08DZ60MLC - 8-bit S08DZ MCU, 60KB Flash, 32-LQFP | NXP

MC9S08DZ60MLC - 8-bit S08DZ MCU, 60KB Flash, 32-LQFP | NXP

MC9S08DZ60MLC ✓ Активен

Сравнение характеристик

Параметр MC9S08DZ60AMLC MC9S08DZ60MLC
Бренд NXP Semiconductors NXP Semiconductors
Категория Microcontrollers Microcontrollers
Статус жизненного цикла NRND Активен
Наличие In Stock In Stock
Цена за единицу (USD) $6,15 $5,08
Core HCS08 (CISC, 8-bit) —
CPU Frequency 40 MHz (20 MHz bus) —
Program Memory 60 KB Flash —
RAM 4 KB 4 KB
EEPROM 2 KB —
Напряжение питания 2.7 V to 5.5 V —
ADC 24-channel, 12-bit, 2.5 us conversion 12-bit (channels vary by package)
CAN Interface 1x MSCAN (CAN 2.0A/B) —
SCI / UART 2 —
SPI 1 —
I/O Pins 40 (32-LQFP exposed count varies by mux) —
LCD Driver Up to 8x36 segments —
Timers TPM channels included —
Корпус 32-LQFP (7x7 mm, 0.5 mm pitch) 32-LQFP (7x7 mm)
Рабочая температура -40 C to +125 C (automotive grade) —
Статус RoHS Compliant Compliant (per distributor listings)
Уровень MSL [DATA_NEEDED: MSL level] —
Core Architecture — HCS08 (S08 family) - 8-bit
CPU Core — HCS08 with HC08 instruction set (plus BGND)
Core Clock Frequency — 40 MHz
Internal Bus Speed — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
EEPROM / Emulated EEPROM — [DATA_NEEDED: EEPROM size]
Тип монтажа — Surface Mount (Gull Wing)
Maximum GPIO — 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset)
Количество выводов — 32
Interrupt Sources — Up to 32
CAN Module — MSCAN (CAN 2.0B) - 1 channel
Timers / PWM — Multiple (TPM, PIT family)
Operating Voltage Range — [DATA_NEEDED: VDD min/max]
Диапазон рабочих температур — -40C to +125C (automotive grade; verify per suffix)
Debug Interface — BDM (Background Debug Mode)
Lead-Free / Halogen-Free — Lead-Free per NXP packaging standards

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