MC9S08DZ60AMLC vs MC9S08DZ60MLC Vergleich
Detaillierter Direktvergleich von MC9S08DZ60AMLC von NXP Semiconductors und MC9S08DZ60MLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DZ60AMLC | MC9S08DZ60MLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,15 | $5,08 |
| Core | HCS08 (CISC, 8-bit) | — |
| CPU Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 60 KB Flash | — |
| RAM | 4 KB | 4 KB |
| EEPROM | 2 KB | — |
| Versorgungsspannung | 2.7 V to 5.5 V | — |
| ADC | 24-channel, 12-bit, 2.5 us conversion | 12-bit (channels vary by package) |
| CAN Interface | 1x MSCAN (CAN 2.0A/B) | — |
| SCI / UART | 2 | — |
| SPI | 1 | — |
| I/O Pins | 40 (32-LQFP exposed count varies by mux) | — |
| LCD Driver | Up to 8x36 segments | — |
| Timers | TPM channels included | — |
| Gehäuse | 32-LQFP (7x7 mm, 0.5 mm pitch) | 32-LQFP (7x7 mm) |
| Betriebstemperatur | -40 C to +125 C (automotive grade) | — |
| RoHS-Status | Compliant | Compliant (per distributor listings) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Core Architecture | — | HCS08 (S08 family) - 8-bit |
| CPU Core | — | HCS08 with HC08 instruction set (plus BGND) |
| Core Clock Frequency | — | 40 MHz |
| Internal Bus Speed | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM / Emulated EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Montageart | — | Surface Mount (Gull Wing) |
| Maximum GPIO | — | 53 GPIO + 1 input-only (family-wide; 32-LQFP exposed subset) |
| Anzahl der Pins | — | 32 |
| Interrupt Sources | — | Up to 32 |
| CAN Module | — | MSCAN (CAN 2.0B) - 1 channel |
| Timers / PWM | — | Multiple (TPM, PIT family) |
| Operating Voltage Range | — | [DATA_NEEDED: VDD min/max] |
| Betriebstemperaturbereich | — | -40C to +125C (automotive grade; verify per suffix) |
| Debug Interface | — | BDM (Background Debug Mode) |
| Lead-Free / Halogen-Free | — | Lead-Free per NXP packaging standards |