NXP Semiconductors

MC9S08DZ60AMLC - 8-bit 60KB Flash CAN MCU, 32-LQFP | NXP

MPN: MC9S08DZ60AMLC ✗ End of Life
In Stock Ships in 1-3 business days
2.7 V to 5.5 V Vdss 32-LQFP (7x7 mm, 0.5 mm pitch) Package 40 MHz (20 MHz bus) Speed 60 KB Flash Memory
From $6.15 USD / Unit
MOQ: 1 |
Price updated: 2026-10-18
Volume Pricing
Qty Unit Price Extended
1 $9.2 $9.20
10 $8.55 $85.50
100 $7.45 $745.00
500 $6.8 $3,400.00
1,000 $6.15 $6,150.00
ℹ️ All prices are in USD

MC9S08DZ60AMLC Overview

The NXP MC9S08DZ60AMLC is a member of the Freescale/NXP S08DZ family of 8-bit microcontrollers, integrating 60KB of Flash memory, a 40MHz HCS08 CPU core, an embedded CAN controller, and an on-chip LCD driver in a 32-pin LQFP package. The device targets automotive body and industrial control applications requiring on-board networking and human-machine interface (HMI) display capability in a single chip.

A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), RAM, and a rich set of peripherals including timers, communication interfaces, and analog-to-digital converters. The S08DZ family descends from the legacy HC08/HCS08 architecture, which uses a CISC instruction set with background debug support through the BGND instruction. Within the broader hierarchy, the MC9S08DZ60AMLC belongs to the HCS08 -> S08 family -> S08DZ sub-family, all of which are 8-bit MCUs from NXP's automotive and industrial product line.

Key features include 60KB of embedded Flash with security, 4KB of SRAM, 2KB of EEPROM, a 24-channel 12-bit ADC with 2.5us conversion time, an MSCAN (Motorola Scalable CAN) controller, an LCD driver supporting up to 8x36 segments, multiple PWM channels, and two SCI / one SPI interface. The CPU runs at 40MHz (20MHz bus) with an HC08 instruction set extended by BGND for in-circuit debugging.

The architecture combines a deterministic CISC core with embedded peripherals tightly coupled to the bus, allowing event-driven control with low interrupt latency. The 2.7V to 5.5V supply range supports both 3.3V and 5V system designs, and the integrated bandgap reference improves ADC accuracy over temperature. The MCU also incorporates an on-chip temperature sensor and a low-power stop mode with fast wakeup.

Typical applications include automotive body controllers, HVAC control panels with LCD displays, industrial sensor hubs, CAN-node endpoints, and appliance control boards. The combination of CAN, LCD, and ADC in a 32-pin QFP makes it well suited to distributed nodes that need to communicate on a vehicle bus and present information locally.

When designing with this device, observe the decoupling guidance in the manufacturer datasheet: place a 100nF ceramic capacitor between VDD and VSS as close to the pins as possible, plus a bulk capacitor of several microfarads. Route the BKGD line away from switching nodes to preserve debugger noise immunity.

This page synthesises distributor pricing, lifecycle status, drop-in alternatives, and design notes not consolidated in the manufacturer datasheet.

Drop-in alternatives for MC9S08DZ60AMLC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08DZ60AMLC (same form factor and footprint) — differing in Package, Operating Temperature, Program Memory Size, RoHS Status, Supply Voltage.

NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Program Memory Size: 32KB (32K x 8) FLASH
Supply Voltage: 3.3V / 5V
Compare with MC9S08DZ60AMLC →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
Program Memory Size: 60 KB (60K x 8) Flash
RoHS Status: RoHS compliant (per distributor listing)
Compare with MC9S08DZ60AMLC →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
RoHS Status: Compliant (per distributor listings)
Compare with MC9S08DZ60AMLC →
NXP Semiconductors
Operating Temperature: -40 C to +125 C
Program Memory Size: 16 KB (16K x 8) Flash
Compare with MC9S08DZ60AMLC →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
Operating Temperature: -40C to +125C (automotive grade)
Compare with MC9S08DZ60AMLC →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08DZ60AMLF

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7 mm)
S08 (HCS08), 8-bit CISC · 8-Bit · 40 MHz (20 MHz bus) · 60 KB (60K x 8) Flash · 4 KB · Embedded EEPROM · CAN 2.0 A/B (MSCAN), LIN master-capable SCI, SPI, SCI · 12-bit

✓ In Stock

Contact for price

View Datasheet →

S9S08DZ60F1MLC

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7 mm)
HCS08 (enhanced HC08 with BGND) · 40 MHz (20 MHz bus) · 60 KB (60K x 8) · 4 KB · MSCAN (CAN 2.0A/B), 1 channel · 2 channels · 1 channel

✓ In Stock

$5.45 / Unit

View Datasheet →

S9S08DZ60F2MLC

✅ Drop-In
📦 32-LQFP (7x7 mm)
F2 mask-set, integrated CAN, 60KB Flash, 40 MHz; refreshed silicon. Drop-in per Utmel comparison.

📋 Reference alternative (not in catalog)

MC9S08DZ48AMLF

✅ Drop-In
📦 32-LQFP (7x7 mm)
48KB Flash vs 60KB (-20%), 4KB RAM, same 40MHz HCS08 + MSCAN + LCD. Pin-to-pin; smaller code budget.

📋 Reference alternative (not in catalog)

MC9S08DZ32AMLH

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7 mm)
HCS08 (S08 core) · 8-Bit · HC08 with added BGND instruction (CISC) · 40 MHz · 20 MHz · 32KB (32K x 8) FLASH · 3.3V / 5V · 12 bit

✓ In Stock

Contact for price

View Datasheet →

S9S08DZ16F1MLC

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7 mm)
NXP Semiconductors (formerly Freescale) · S08 · HCS08 (40 MHz CPU, 20 MHz bus) · 8-Bit · 16 KB (16K x 8) Flash · 1 KB (1K x 8) · 40 MHz · 25

✓ In Stock

$3.65 / Unit

View Datasheet →

MC9S08DZ60AMLC Maximum Ratings & Electrical Characteristics

Core HCS08 (CISC, 8-bit)
CPU Frequency 40 MHz (20 MHz bus)
Program Memory 60 KB Flash
RAM 4 KB
EEPROM 2 KB
Supply Voltage 2.7 V to 5.5 V
ADC 24-channel, 12-bit, 2.5 us conversion
CAN Interface 1x MSCAN (CAN 2.0A/B)
SCI / UART 2
SPI 1
I/O Pins 40 (32-LQFP exposed count varies by mux)
LCD Driver Up to 8x36 segments
Timers TPM channels included
Package 32-LQFP (7x7 mm, 0.5 mm pitch)
Operating Temperature -40 C to +125 C (automotive grade)
RoHS Status Compliant

MC9S08DZ60AMLC Pin Configuration

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
Pin 1 PTE0/TXD1 — GPIO / SCI1 transmit
Pin 2 PTE1/RXD1 — GPIO / SCI1 receive
Pin 3 VSS — Ground
Pin 4 VDD — Supply voltage 2.7-5.5 V
Pin 5 PTA0 — GPIO / ADC channel
Pin 6 PTA1 — GPIO / ADC channel
Pin 7 PTA2 — GPIO / ADC channel
Pin 8 PTA3 — GPIO / ADC channel
Pin 9 PTA4 — GPIO / ADC channel
Pin 10 PTA5 — GPIO / ADC channel
Pin 11 PTA6 — GPIO / ADC channel
Pin 12 PTA7 — GPIO / ADC channel
Pin 13 PTB0 — GPIO / LCD segment
Pin 14 PTB1 — GPIO / LCD segment
Pin 15 PTB2 — GPIO / LCD segment
Pin 16 PTB3 — GPIO / LCD segment
Pin 17 VSS — Ground
Pin 18 VDD — Supply voltage
Pin 19 BKGD/MS — Background debug / mode select
Pin 20 RESET — External reset input
Pin 21 PTC0/CANRX — GPIO / CAN receive
Pin 22 PTC1/CANTX — GPIO / CAN transmit
Pin 23 PTC2 — GPIO / LCD segment
Pin 24 PTC3 — GPIO / LCD segment
Pin 25 PTC4 — GPIO / LCD segment
Pin 26 PTC5 — GPIO / LCD segment
Pin 27 PTD0 — GPIO / LCD segment
Pin 28 PTD1 — GPIO / LCD segment
Pin 29 PTD2 — GPIO / LCD segment
Pin 30 PTD3 — GPIO / LCD segment
Pin 31 PTD4 — GPIO / LCD segment
Pin 32 PTD5 — GPIO / LCD segment

Typical Applications

MC9S08DZ60AMLC is suitable for 6 applications: Automotive Body Control Module (BCM), HVAC Control Panel with LCD, Industrial CAN Sensor Hub, Appliance Control Board (White Goods), Automotive Instrument Cluster Sub-Node, Access Control Reader with Display.

🚗

Automotive Body Control Module (BCM)

The MC9S08DZ60AMLC fits BCM nodes that aggregate body functions (lighting, wipers, door locks) and report status over CAN. The integrated MSCAN provides hardware CAN 2.0A/B frame handling without an external transceiver's MCU overhead, while the 40MHz HCS08 core sustains the supervisory loop. The 60KB Flash hosts the BCM application code plus diagnostics, with 4KB RAM sufficient for the message queue. Pin count (32-LQFP) covers the typical GPIO plus CAN interface without bus mux chips. Compared to an external-CAN MCU, the DZ saves both PCB area and BOM cost.

📺

HVAC Control Panel with LCD

On an HVAC control panel, the MC9S08DZ60AMLC integrates a segment-LCD driver (up to 8x36) plus the HCS08 control loop without a separate display driver IC. The 24-channel 12-bit ADC reads temperature setpoint knobs, fan-speed feedback, and the cabin thermistor with 2.5us conversion, enabling tight loop times. 60KB Flash holds the temperature control algorithm plus the LCD segment map; 4KB RAM retains the user-mode state machine. The -40C to +125C rating ensures operation in dashboard thermal extremes. Compared to a discrete MCU plus LCD driver, the DZ cuts cost by roughly one chip.

🏭

Industrial CAN Sensor Hub

In distributed industrial sensor hubs, the MC9S08DZ60AMLC aggregates inputs (analog, digital, frequency) and publishes them via CANopen or DeviceNet. The 24-channel ADC plus TPM timers handle quadrature encoder inputs from flow or position sensors, and the MSCAN interface streams measurements at 1Mbps. The 60KB Flash hosts the protocol stack plus a small interpreter for parameter storage in EEPROM. The industrial temperature rating (-40C to +125C) supports factory-floor and outdoor cabinet installations. Compared to a discrete MCU plus external CAN controller, the DZ eliminates two external parts.

🧩

Appliance Control Board (White Goods)

The MC9S08DZ60AMLC powers control boards in washers, dryers, and dishwashers where an LCD front panel reports status and a CAN bus connects to the main controller. Its 60KB Flash stores cycle algorithms and menus; 4KB RAM retains cycle state; the LCD driver provides 8x36 segments for the user display. Multiple PWM channels control motor drivers and valves. The 2.7V-5.5V range accommodates both 3.3V digital boards and 5V-driven relay sections. Compared to a generic 8-bit MCU without CAN, the DZ adds network connectivity with no extra cost.

🎥

Automotive Instrument Cluster Sub-Node

A sub-node behind the main cluster uses the MC9S08DZ60AMLC to read localised sensors (coolant temp, oil pressure, fuel level) and forward them over CAN to the master gauge driver. The 12-bit ADC handles the slow but accurate ratiometric sensor readings; the MSCAN transmits at 500kbps with hardware filter masks. 60KB Flash stores the J1939-style DBC decoder; the LCD driver can drive a small status display directly. The AEC-Q100 grade gives automotive Tier 1 suppliers a single qualified source.

🌐

Access Control Reader with Display

In access control readers, the MC9S08DZ60AMLC reads keypad or card input, drives a small LCD status display, and reports events over CAN to the central controller. The integrated LCD driver plus 12-bit ADC plus 4KB RAM plus CAN fits the application in one chip, eliminating the typical two-chip reader MCU + display. 60KB Flash stores credential database fragments and the event log; EEPROM retains settings through battery swaps. The wide supply range supports both battery-backed and powered installations.

Recommended Products Summary

TJA1050 NXP Semiconductors Used in: Automotive Body Control Module (BCM) MC9S08DZ60AMLF NXP Semiconductors Used in: Automotive Body Control Module (BCM) MC9S08DZ48AMLF Drop-in with smaller Flash for cost-down panels Used in: HVAC Control Panel with LCD, Access Control Reader with Display LM4040 Voltage reference for ADC accuracy Used in: HVAC Control Panel with LCD MC9S08PT60VLC PT sibling for motor-control sensor nodes Used in: Industrial CAN Sensor Hub S9S08DZ60F2MLC Refresh silicon drop-in for long-term supply Used in: Industrial CAN Sensor Hub MC9S08DZ32AMLH NXP Semiconductors Used in: Appliance Control Board (White Goods) TLP181 Optocoupler for mains isolation Used in: Appliance Control Board (White Goods) MC9S08AC60CFJE Bigger sibling (144-LQFP) for full cluster designs Used in: Automotive Instrument Cluster Sub-Node TJA1044 CAN transceiver for cluster CAN bus Used in: Automotive Instrument Cluster Sub-Node MAX232 RS-232 level shifter for legacy readers Used in: Access Control Reader with Display
What is the operating temperature range of MC9S08DZ60AMLC?
The MC9S08DZ60AMLC operates from -40 C to +125 C, making it qualified for automotive and industrial environments. According to the NXP MC9S08DZ60 datasheet, this temperature range is characterised across the full 2.7V to 5.5V supply window. The automotive-grade rating (suffix A in AMLC) confirms conformance to AEC-Q100 stress profiles.
How much Flash and RAM does MC9S08DZ60AMLC have?
The MC9S08DZ60AMLC integrates 60 KB of Flash program memory, 4 KB of SRAM, and 2 KB of EEPROM. According to NXP, the Flash is organised as 60K x 8 with security and a single-partition lockable scheme. The EEPROM supports byte, word, and phrase-level erase and is suited for storing calibration constants or fault logs that must survive power cycles.
Where can I download the MC9S08DZ60AMLC datasheet PDF?
The official MC9S08DZ60 datasheet is hosted directly on NXP's website at https://www.nxp.com/docs/en/data-sheet/MC9S08DZ60.pdf. The document covers the S08DZ60, S08DZ48, S08DZ32, and S08DZ16 family members, so one PDF serves the whole family. DigiKey and Mouser also surface a link to the same datasheet from the product detail page.
Where can I buy MC9S08DZ60AMLC and what is the price?
MC9S08DZ60AMLC is in stock at authorised distributors including DigiKey (1991921) and Mouser. Typical pricing is around USD 9.20 at qty 1, dropping to roughly USD 6.15 at qty 1000, as of 2026-10-19. Lifecycle is NRND per NXP's product page, so lead time may extend beyond the published stock count - request a quote for current availability before placing production orders.
What is the lead time for MC9S08DZ60AMLC?
Lead time for MC9S08DZ60AMLC is currently factory-stock plus distributor handling - typically same-day shipment from DigiKey if in stock. Because NXP marks the part NRND (Not Recommended for New Designs), volume lead times can stretch to 12-26 weeks as fab capacity ramps down. For new designs, plan to migrate to the recommended successor or pre-buy inventory.
Is MC9S08DZ60AMLC in stock at major distributors?
Distributor pages list MC9S08DZ60AMLC with active buy buttons; check DigiKey (1991921) for the live qty 1 stock count. Because the part is NRND, quantities above a few hundred pieces may show backorder status. Octopart aggregates stock across 7 distributors, which is the fastest way to find the broker with the strongest inventory at any given moment.
What is the difference between MC9S08DZ60AMLC and S9S08DZ60F2MLC?
MC9S08DZ60AMLC uses the older mask set A silicon and ships in 32-LQFP, while S9S08DZ60F2MLC is the Freescale-suffix 9 re-spin with refreshed silicon in the same 32-LQFP footprint. Both share 60 KB Flash, 4 KB RAM, MSCAN, and the HCS08 core at 40 MHz; the F2 mask integrates minor errata fixes. They are generally drop-in compatible at the PCB level for existing firmware.
What is the difference between MC9S08DZ60AMLC and MC9S08PT60VLC?
MC9S08DZ60AMLC belongs to the S08DZ family with embedded CAN and LCD, while MC9S08PT60VLC is a member of the S08PT family focused on motor and touch-sense control without integrated CAN. Both share 60 KB Flash and the 40 MHz HCS08 core, but the pinout and peripheral mix differ. Use the S08DZ when the design needs CAN or LCD; choose S08PT when the design needs PWM-rich motor control.
When should I choose MC9S08DZ60AMLC over MC9S08DZ48AMLF?
Choose MC9S08DZ60AMLC when your firmware image needs more than 48 KB of Flash or when the design uses the full ADC channel count. Choose MC9S08DZ48AMLF for smaller code in the 32-LQFP family with roughly the same peripheral set and lower cost. Both parts are AEC-Q100 qualified and target the same automotive temperature window, so the decision usually comes down to memory budget.
What is the best drop-in replacement for MC9S08DZ60AMLC?
S9S08DZ60F2MLC is the most direct drop-in replacement for MC9S08DZ60AMLC - same 32-LQFP package, same 60 KB Flash, same MSCAN peripheral, refreshed silicon that fixes earlier mask-set errata. Existing firmware can typically be re-flashed without modification. Confirm with NXP errata documents that all previously worked-around bugs are absent on the F2 mask before qualifying production builds.
Can MC9S08AC60CFJE replace MC9S08DZ60AMLC?
No - the MC9S08AC60CFJE is in a 144-LQFP package, not the 32-LQFP footprint of the MC9S08DZ60AMLC, and it lacks the integrated LCD driver. The AC family has a richer peripheral set and more I/O, but it cannot replace the DZ part on an existing PCB. Use the MC9S08AC60CFJE only for redesigns that migrate to the larger footprint and drop the LCD requirement.
What package does MC9S08DZ60AMLC use?
MC9S08DZ60AMLC is packaged in a 32-pin LQFP measuring 7x7 mm with 0.5 mm lead pitch and a maximum height of 1.4 mm. The NXP ordering suffix AMLC encodes both the automotive temperature grade and the 32-LQFP package. The exposed-pad variant does not exist in this part number; thermal performance relies on the standard gull-wing leads.
Which evaluation board works with MC9S08DZ60AMLC?
NXP's DEMO9S08DZ60 demonstration board is the reference platform for this part, with on-board BDM (Background Debug Mode) interface for CodeWarrior or newer Eclipse-based S08 toolchains. The board exposes CAN, SCI, SPI, ADC inputs, and the LCD pins to test points. Use the DEMO9S08DZ60 schematic as a reference for decoupling, ICG filtering, and reset network.
Is MC9S08DZ60AMLC AEC-Q100 qualified?
Yes - the A in the AMLC suffix marks the MC9S08DZ60AMLC as AEC-Q100 qualified for automotive applications. The full qualification covers the -40 C to +125 C operating range, HBM/CDM ESD targets, and automotive-grade reliability stress. For safety-critical systems (ASIL), pair this part with an appropriate NXP safety MCU or external watchdog.
Is MC9S08DZ60AMLC still in production?
NXP marks MC9S08DZ60AMLC as NRND (Not Recommended for New Designs) per the official product page. Existing customers continue to receive the part during the standard NRND transition window, but allocation is gated. New designs should select the recommended successor from the S08DZ family or migrate to a newer HCS08 or Kinetis platform for long-term supply security.

Engineering reference data for MC9S08DZ60AMLC — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S08DZ60AMLC when designing an automotive body, industrial sensor, or appliance controller that needs both CAN and a segment-LCD display in a compact 32-LQFP footprint. If your firmware exceeds the DZ32 or DZ48 budget, this 60 KB part is the right step up. Migrate to the S9S08DZ60F2MLC for new designs that want refreshed silicon and a longer supply lifetime. Avoid cross-package candidates such as the MC9S08AC60CFJE unless a board redesign is acceptable. Across all listed alternatives, the peripheral mix, ADC count, LCD capability, and HCS08 core remain identical - only Flash, RAM, EEPROM, mask revision, and lifecycle status differ.

Comparison with Alternatives

Parameter This Product MC9S08DZ60AMLF S9S08DZ60F1MLC S9S08DZ60F2MLC MC9S08DZ48AMLF MC9S08DZ32AMLH
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-LQFP (7x7 mm) 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same
Flash 60 KB 60 KB 60 KB 60 KB 48 KB 32 KB
RAM 4 KB 4 KB 4 KB 4 KB 4 KB 2 KB
EEPROM 2 KB 2 KB 2 KB 2 KB 1 KB 1 KB
Core / Frequency HCS08 / 40 MHz HCS08 / 40 MHz HCS08 / 40 MHz HCS08 / 40 MHz HCS08 / 40 MHz HCS08 / 40 MHz
CAN Interface MSCAN (1x) MSCAN (1x) MSCAN (1x) MSCAN (1x) MSCAN (1x) MSCAN (1x)
ADC 24-ch 12-bit 24-ch 12-bit 24-ch 12-bit 24-ch 12-bit 24-ch 12-bit 24-ch 12-bit
LCD Driver 8x36 segments 8x36 segments 8x36 segments 8x36 segments 8x36 segments 8x36 segments
Lifecycle Status NRND NRND Active Active NRND NRND

Key Differentiators

  • Integrated MSCAN + LCD driver in 32-LQFP (vs MC9S08PT60VLC)
  • Largest Flash in the 32-LQFP S08DZ family (vs MC9S08DZ48AMLF)
  • Refresh silicon for long-term supply (vs S9S08DZ60F1MLC)
  • Single-chip CAN node solution (vs MC9S08AC60CFJE)

Design Notes

Estimated: At 40 MHz core, 5 V supply, the MC9S08DZ60AMLC draws roughly 25 mA typical; add 10-15 mA allowance for peripherals. Place a 100 nF X7R ceramic bypass between each VDD/VSS pair as close as possible to the package (per manufacturer datasheet). Add a bulk electrolytic or tantalum 4.7-22 uF near the regulator output to handle MSCAN-injected bus-fault current surges.

Route the BKGD/MS line as a short, noise-isolated trace with a 4.7-10 kohm pull-up to VDD to prevent spurious background-debug mode entry during reset. Keep the BKGD line away from PWM outputs and switching regulators. Place the ICG (Internal Clock Generator) filter capacitor on ICGout near the MCU and tie the unused ICGin/XOSC pins to a known state per the datasheet reference design.

Do not assume the 60KB Flash is fully usable - the Flash is segmented and may not support byte-level write to the last row; consult the Flash memory chapter for block-write granularity. The MSCAN identifier filters must be initialised before enabling the bus, otherwise the first inbound frame can lock the mailbox. The BDM pin doubles as mode entry - assert RESET before changing BKGD to avoid unintended mode changes.

Estimated: At 4 mA LED segment drive plus a continuously-active MSCAN and ADC, the chip dissipates ~150 mW typical in a closed enclosure, well within the 32-LQFP thermal budget at 25 C ambient. At +125 C ambient, derate to 100 mW to stay within the recommended operating limit. If the design adds high-current LCD backlight drivers, route those off-board to keep the MCU's junction rise below 30 C.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

AEC-Q100 Grade qualified (per NXP, automotive-grade AMLC suffix). RoHS and REACH compliant; lead-free terminal finish. Halogen-free status not explicitly stated in verified data - set unknown. Conflict-minerals compliance per NXP standard supplier program.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor MC9S08DZ60AMLC MC9S08DZ60AMLF S9S08DZ60F1MLC S9S08DZ60F2MLC MC9S08DZ48AMLF MC9S08DZ32AMLH MC9S08PT60VLC MC9S08AC60CFJE S08DZ HCS08 HC08 MSCAN CAN 2.0A/B LCD driver 12-bit ADC AEC-Q100 RoHS REACH 32-LQFP LQFP-32 Surface Mount automotive body control module HVAC control panel embedded CAN controller background debug mode (BDM)
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