MC9S08MM32CLH vs MC9S08DN60ACLH Comparison

Detailed side-by-side comparison of MC9S08MM32CLH by NXP Semiconductors and MC9S08DN60ACLH by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08MM32CLH MC9S08MM32CLH - 8-Bit 48MHz S08 MCU 32KB Flash LQFP-64 | NXP

MC9S08MM32CLH - 8-Bit 48MHz S08 MCU 32KB Flash LQFP-64 | NXP

MC9S08MM32CLH ✓ Active
NXP Semiconductors
MC9S08DN60ACLH MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP

MC9S08DN60ACLH Nrnd

Specification Comparison

Parameter MC9S08MM32CLH MC9S08DN60ACLH
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active NRND
Stock Status In Stock In Stock
Unit Price (USD) $3.32 $5.21
Manufacturer NXP Semiconductors (formerly Freescale) —
Series S08MM —
Core Processor HCS08 (S08 CISC) —
Core Size 8-Bit —
Core Speed 48 MHz —
Program Memory 32 KB Flash (32K x 8) —
RAM Size 2 KB 2 KB (2K x 8)
Data EEPROM Not specified in datasheet excerpt —
Supply Voltage 1.8 V to 3.6 V (2.5 V/3.3 V typical) —
Operating Temperature -40C to +85C -40C to +85C [DATA_NEEDED: confirm automotive grade range]
Package 64-LQFP (10x10 mm) —
Mounting Type Surface Mount Surface Mount
Program Memory Type FLASH —
Connectivity SCI, SPI, I2C —
Peripherals PWM, 12-bit ADC, Analog Comparator, Timers —
Number of I/O 56 (approximate, GPIO capable) 53
Oscillator Type Internal + External Crystal External
Moisture Sensitivity Level [DATA_NEEDED: MSL rating] —
RoHS Compliant —
Core — HCS08 (S08 core)
Data Bus Width — 8 bit
CPU Frequency — 40 MHz
Bus Frequency — 20 MHz
Program Memory (Flash) — 60 KB (60K x 8)
EEPROM — Embedded (size [DATA_NEEDED: EEPROM size])
Package / Case — 64-LQFP (10x10 mm)
ADC — 16-channel, 12-bit, 2.5 us conversion
Communication Interfaces — CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C
Interrupt Sources — Up to 32
Packaging — Tray
RoHS Status — Compliant
Instruction Set — HC08 + BGND instruction
On-Chip Debug — BDM (Background Debug Mode)

Datasheets & Resources

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