MC9S08MM32CLH vs MC9S08DN60ACLH Comparação
Comparação detalhada lado a lado de MC9S08MM32CLH por NXP Semiconductors e MC9S08DN60ACLH por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08MM32CLH - 8-Bit 48MHz S08 MCU 32KB Flash LQFP-64 | NXP
MC9S08MM32CLH ✓ AtivoComparação de especificações
| Parâmetro | MC9S08MM32CLH | MC9S08DN60ACLH |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3,32 | $5,21 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08MM | — |
| Core Processor | HCS08 (S08 CISC) | — |
| Core Size | 8-Bit | — |
| Core Speed | 48 MHz | — |
| Program Memory | 32 KB Flash (32K x 8) | — |
| RAM Size | 2 KB | 2 KB (2K x 8) |
| Data EEPROM | Not specified in datasheet excerpt | — |
| Tensão de alimentação | 1.8 V to 3.6 V (2.5 V/3.3 V typical) | — |
| Temperatura de operação | -40C to +85C | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Encapsulamento | 64-LQFP (10x10 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Connectivity | SCI, SPI, I2C | — |
| Peripherals | PWM, 12-bit ADC, Analog Comparator, Timers | — |
| Number of I/O | 56 (approximate, GPIO capable) | 53 |
| Oscillator Type | Internal + External Crystal | External |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| RoHS | Compliant | — |
| Core | — | HCS08 (S08 core) |
| Largura do barramento de dados | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Encapsulamento / Caixa | — | 64-LQFP (10x10 mm) |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| Status RoHS | — | Compliant |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |