MC9S08MM32CLH vs MC9S08DN60ACLH Vergleich
Detaillierter Direktvergleich von MC9S08MM32CLH von NXP Semiconductors und MC9S08DN60ACLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08MM32CLH - 8-Bit 48MHz S08 MCU 32KB Flash LQFP-64 | NXP
MC9S08MM32CLH ✓ AktivSpezifikationsvergleich
| Parameter | MC9S08MM32CLH | MC9S08DN60ACLH |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,32 | $5,21 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | S08MM | — |
| Core Processor | HCS08 (S08 CISC) | — |
| Core Size | 8-Bit | — |
| Core Speed | 48 MHz | — |
| Program Memory | 32 KB Flash (32K x 8) | — |
| RAM Size | 2 KB | 2 KB (2K x 8) |
| Data EEPROM | Not specified in datasheet excerpt | — |
| Versorgungsspannung | 1.8 V to 3.6 V (2.5 V/3.3 V typical) | — |
| Betriebstemperatur | -40C to +85C | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| Gehäuse | 64-LQFP (10x10 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Connectivity | SCI, SPI, I2C | — |
| Peripherals | PWM, 12-bit ADC, Analog Comparator, Timers | — |
| Number of I/O | 56 (approximate, GPIO capable) | 53 |
| Oscillator Type | Internal + External Crystal | External |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL rating] | — |
| RoHS | Compliant | — |
| Core | — | HCS08 (S08 core) |
| Datenbusbreite | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| Gehäuse / Bauform | — | 64-LQFP (10x10 mm) |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Interrupt Sources | — | Up to 32 |
| Packaging | — | Tray |
| RoHS-Status | — | Compliant |
| Instruction Set | — | HC08 + BGND instruction |
| On-Chip Debug | — | BDM (Background Debug Mode) |