MC9S08QD4VPC vs MC9S08QD4MPC Comparison

Detailed side-by-side comparison of MC9S08QD4VPC by NXP Semiconductors and MC9S08QD4MPC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08QD4VPC MC9S08QD4VPC - 8-bit S08 MCU, 4KB Flash, 16MHz, DIP-8 | NXP

MC9S08QD4VPC - 8-bit S08 MCU, 4KB Flash, 16MHz, DIP-8 | NXP

MC9S08QD4VPC ✓ Active
NXP Semiconductors
MC9S08QD4MPC MC9S08QD4MPC - 8-bit HCS08 MCU, 4KB Flash, DIP-8 | NXP

MC9S08QD4MPC - 8-bit HCS08 MCU, 4KB Flash, DIP-8 | NXP

MC9S08QD4MPC ✓ Active

Specification Comparison

Parameter MC9S08QD4VPC MC9S08QD4MPC
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1.92 $1.92
Core S08 (HCS08) 8-bit CPU HCS08 (enhanced 8-bit)
Instruction Set HC08 with added BGND HC08 with BGND
Maximum CPU Frequency 16 MHz (8 MHz bus) 16 MHz (8 MHz bus)
Program Memory (Flash) 4 KB (4K x 8) 4 KB
RAM 256 bytes 256 bytes
Supply Voltage Range 2.7 V to 5.5 V —
Package 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm)
GPIO Pins 6 —
ADC 4-channel, 10-bit 4-channel, 10-bit
Timers MTIM and TPM (per datasheet) —
Communication Interfaces SCI (UART), I2C multimaster —
Debug Interface Background Debug Mode (BDM), 3 breakpoints Background Debug Mode (BDM), single breakpoint + 2 on-chip breakpoints
Operating Temperature -40 C to +85 C (industrial, typical) —
Mounting Type Through-hole (DIP) Through-Hole
RoHS Status [DATA_NEEDED: RoHS status from datasheet] Compliant
MSL Level [DATA_NEEDED: MSL level for DIP-8] —
General-Purpose I/O Pins — 6
Clock Source — Internal oscillator, external crystal/resonator support
Family — S08QD (lowest-end S08 8-bit family)
Architecture — CISC
Lead-Free — Yes

Datasheets & Resources

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