MC9S08QD4VPC vs MC9S08QD4MPC Vergleich
Detaillierter Direktvergleich von MC9S08QD4VPC von NXP Semiconductors und MC9S08QD4MPC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08QD4VPC | MC9S08QD4MPC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,92 | $1,92 |
| Core | S08 (HCS08) 8-bit CPU | HCS08 (enhanced 8-bit) |
| Instruction Set | HC08 with added BGND | HC08 with BGND |
| Maximum CPU Frequency | 16 MHz (8 MHz bus) | 16 MHz (8 MHz bus) |
| Program Memory (Flash) | 4 KB (4K x 8) | 4 KB |
| RAM | 256 bytes | 256 bytes |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Gehäuse | 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) | 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) |
| GPIO Pins | 6 | — |
| ADC | 4-channel, 10-bit | 4-channel, 10-bit |
| Timers | MTIM and TPM (per datasheet) | — |
| Communication Interfaces | SCI (UART), I2C multimaster | — |
| Debug Interface | Background Debug Mode (BDM), 3 breakpoints | Background Debug Mode (BDM), single breakpoint + 2 on-chip breakpoints |
| Betriebstemperatur | -40 C to +85 C (industrial, typical) | — |
| Montageart | Through-hole (DIP) | Through-Hole |
| RoHS-Status | [DATA_NEEDED: RoHS status from datasheet] | Compliant |
| MSL-Level | [DATA_NEEDED: MSL level for DIP-8] | — |
| General-Purpose I/O Pins | — | 6 |
| Clock Source | — | Internal oscillator, external crystal/resonator support |
| Family | — | S08QD (lowest-end S08 8-bit family) |
| Architecture | — | CISC |
| Lead-Free | — | Yes |