MC9S08QD4VPC vs MC9S08QD4MPC Comparaison
Comparaison détaillée côte à côte de MC9S08QD4VPC par NXP Semiconductors et MC9S08QD4MPC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QD4VPC | MC9S08QD4MPC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1,92 | $1,92 |
| Core | S08 (HCS08) 8-bit CPU | HCS08 (enhanced 8-bit) |
| Instruction Set | HC08 with added BGND | HC08 with BGND |
| Maximum CPU Frequency | 16 MHz (8 MHz bus) | 16 MHz (8 MHz bus) |
| Program Memory (Flash) | 4 KB (4K x 8) | 4 KB |
| RAM | 256 bytes | 256 bytes |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Boîtier | 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) | 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) |
| GPIO Pins | 6 | — |
| ADC | 4-channel, 10-bit | 4-channel, 10-bit |
| Timers | MTIM and TPM (per datasheet) | — |
| Communication Interfaces | SCI (UART), I2C multimaster | — |
| Debug Interface | Background Debug Mode (BDM), 3 breakpoints | Background Debug Mode (BDM), single breakpoint + 2 on-chip breakpoints |
| Température de fonctionnement | -40 C to +85 C (industrial, typical) | — |
| Type de montage | Through-hole (DIP) | Through-Hole |
| Statut RoHS | [DATA_NEEDED: RoHS status from datasheet] | Compliant |
| Niveau MSL | [DATA_NEEDED: MSL level for DIP-8] | — |
| General-Purpose I/O Pins | — | 6 |
| Clock Source | — | Internal oscillator, external crystal/resonator support |
| Family | — | S08QD (lowest-end S08 8-bit family) |
| Architecture | — | CISC |
| Lead-Free | — | Yes |