MC9S08QD4VPC vs MC9S08QD4MPC Comparação
Comparação detalhada lado a lado de MC9S08QD4VPC por NXP Semiconductors e MC9S08QD4MPC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08QD4VPC | MC9S08QD4MPC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Ativo |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1,92 | $1,92 |
| Core | S08 (HCS08) 8-bit CPU | HCS08 (enhanced 8-bit) |
| Instruction Set | HC08 with added BGND | HC08 with BGND |
| Maximum CPU Frequency | 16 MHz (8 MHz bus) | 16 MHz (8 MHz bus) |
| Program Memory (Flash) | 4 KB (4K x 8) | 4 KB |
| RAM | 256 bytes | 256 bytes |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Encapsulamento | 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) | 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) |
| GPIO Pins | 6 | — |
| ADC | 4-channel, 10-bit | 4-channel, 10-bit |
| Timers | MTIM and TPM (per datasheet) | — |
| Communication Interfaces | SCI (UART), I2C multimaster | — |
| Debug Interface | Background Debug Mode (BDM), 3 breakpoints | Background Debug Mode (BDM), single breakpoint + 2 on-chip breakpoints |
| Temperatura de operação | -40 C to +85 C (industrial, typical) | — |
| Tipo de montagem | Through-hole (DIP) | Through-Hole |
| Status RoHS | [DATA_NEEDED: RoHS status from datasheet] | Compliant |
| Nível MSL | [DATA_NEEDED: MSL level for DIP-8] | — |
| General-Purpose I/O Pins | — | 6 |
| Clock Source | — | Internal oscillator, external crystal/resonator support |
| Family | — | S08QD (lowest-end S08 8-bit family) |
| Architecture | — | CISC |
| Lead-Free | — | Yes |