MC9S08QG8CDNE vs MC9S08QG8CFQE Comparison

Detailed side-by-side comparison of MC9S08QG8CDNE by NXP Semiconductors and MC9S08QG8CFQE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08QG8CDNE MC9S08QG8CDNE - 20MHz 8-Bit Flash MCU | NXP | SOIC-8

MC9S08QG8CDNE - 20MHz 8-Bit Flash MCU | NXP | SOIC-8

MC9S08QG8CDNE ✓ Active
NXP Semiconductors
MC9S08QG8CFQE MC9S08QG8CFQE - 8-Bit HCS08 MCU 8KB Flash 20MHz | NXP

MC9S08QG8CFQE - 8-Bit HCS08 MCU 8KB Flash 20MHz | NXP

MC9S08QG8CFQE ⚠ Last Time Buy

Specification Comparison

Parameter MC9S08QG8CDNE MC9S08QG8CFQE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $0.00
Product Type 8-bit HCS08 microcontroller —
Maximum CPU Frequency 20 MHz 20 MHz
Bus Frequency 10 MHz —
Architecture CISC —
CPU Core Enhanced HCS08 8-bit CPU —
Instruction Set HC08 with BGND instruction HC08 + BGND
Internal Flash Memory 8 KB —
RAM Memory 0.512 KB —
Supply Voltage 1.8 V to 3.6 V —
I/O Ports 6 —
General-Purpose I/O Pins 4 —
ADC 4-channel 10-bit ADC —
Package 8-pin SOIC, MS-012AA 8-pin DFN-EP (4x4 mm)
Mounting Type Surface mount Surface Mount
Lifecycle Status Active End-of-Life / Last Time Buy (per NXP product page)
RoHS Status Compliant ROHS compliant (per datasheet)
Debug Support Background debugging system with breakpoint capability —
Core — HCS08 (enhanced S08)
CPU Architecture — 8-bit CISC
Program Memory (Flash) — 8 KB (8K x 8)
RAM — [DATA_NEEDED: RAM size]
Supply Voltage (VDD) — 1.8 V to 3.6 V
I/O Pins — Up to 6
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
On-chip Debug — Background Debug Mode (BDCS), 1 + 2 breakpoints
ROM Type — Flash

Datasheets & Resources

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