MC9S08QG8CDNE vs MC9S08QG8CFQE Comparación
Comparación detallada lado a lado de MC9S08QG8CDNE por NXP Semiconductors y MC9S08QG8CFQE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08QG8CFQE - 8-Bit HCS08 MCU 8KB Flash 20MHz | NXP
MC9S08QG8CFQE ⚠ Última compraComparación de especificaciones
| Parámetro | MC9S08QG8CDNE | MC9S08QG8CFQE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,00 |
| Product Type | 8-bit HCS08 microcontroller | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Bus Frequency | 10 MHz | — |
| Architecture | CISC | — |
| CPU Core | Enhanced HCS08 8-bit CPU | — |
| Instruction Set | HC08 with BGND instruction | HC08 + BGND |
| Internal Flash Memory | 8 KB | — |
| RAM Memory | 0.512 KB | — |
| Tensión de alimentación | 1.8 V to 3.6 V | — |
| I/O Ports | 6 | — |
| General-Purpose I/O Pins | 4 | — |
| ADC | 4-channel 10-bit ADC | — |
| Encapsulado | 8-pin SOIC, MS-012AA | 8-pin DFN-EP (4x4 mm) |
| Tipo de montaje | Surface mount | Surface Mount |
| Estado del ciclo de vida | Active | End-of-Life / Last Time Buy (per NXP product page) |
| Estado RoHS | Compliant | ROHS compliant (per datasheet) |
| Debug Support | Background debugging system with breakpoint capability | — |
| Core | — | HCS08 (enhanced S08) |
| CPU Architecture | — | 8-bit CISC |
| Program Memory (Flash) | — | 8 KB (8K x 8) |
| RAM | — | [DATA_NEEDED: RAM size] |
| Supply Voltage (VDD) | — | 1.8 V to 3.6 V |
| I/O Pins | — | Up to 6 |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| On-chip Debug | — | Background Debug Mode (BDCS), 1 + 2 breakpoints |
| ROM Type | — | Flash |